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REALTIME NEWS
Xiaomi to debut tri-fold smartphone, sources say
Communications
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TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Semiconductors
16min ago
Network chipmakers perceive inadequate demand visibility from China
Tomorrow's Headlines
11h 11min ago
Taiwan aerospace supplier AIDC seeks international project partnerships
Tomorrow's Headlines
12h 36min ago
EIH promotes medical care applications on e-paper
Tomorrow's Headlines
12h 43min ago
Walsin posts record PCB capex
Tomorrow's Headlines
Sep 19, 20:38
Radiant plans to acquire Danish optical solutions company
Tomorrow's Headlines
Sep 19, 20:03
Battle for USB4 transmission chip route: Retimer or Redriver
Tomorrow's Headlines
Sep 19, 19:49
Ferrari sales increase in Taiwan; CEO visits frequently
Tomorrow's Headlines
Sep 19, 19:21
Niching expects AI momentum to grow in 2025
Tomorrow's Headlines
Sep 19, 19:21
NEWS TAGGED G-CORE
Monday 12 January 2009
CES 2009: Qualcomm mirasol display adopted by G-Core GPS golf range finder
Qualcomm MEMS Technologies, a wholly owned subsidiary of Qualcomm Incorporated, and G-Core announced...
BIZ FOCUS
Sep 19, 10:26
MEAN WELL promotes green energy innovation focusing on 4 major energy fields and providing comprehensive applications
Wednesday 18 September 2024
LitePoint embraces new opportunities for growth with innovative wireless testing solutions
Friday 13 September 2024
Henkel Adhesives helps customers unlock growth for next-generation advanced packaging
Thursday 12 September 2024
Importance of cloud threat modeling for business security
TOP STORIES
7 DAYS NEWS
How far is China from 28nm process after domestic lithography breakthrough?
Tata plans to build two more fabs in India
Huawei's triple-fold Mate XT reaches 5 million pre-orders, but converting to actual orders will be challenging
Huawei encounters difficulties with Kirin SoC performance breakthroughs
Qualcomm comes up short in AI PC debut, casting doubt on MediaTek market entry
Glass substrate technology gains traction for advanced packaging by 2026
Chinese smartphones employ 3nm chips, exacerbating Qualcomm and MediaTek competition
TSMC solves mass production issues in US; advanced process self-sufficiency may be realized
China races to boost domestic chip output as trade tensions rise
Japanese semiconductor suppliers expand in India amid Chinese import substitution
Full list
RESEARCH INSIGHTS
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
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