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Wednesday 13 September 2017
ASML EUV equipment production to almost double in 2018
ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.
Friday 8 September 2017
SPIL obtains packaging orders for AMD Vega 11 GPUs
AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...
Friday 25 August 2017
AMD Vega graphics cards in shortages
AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...
Thursday 24 August 2017
ASML opens branch office in Nanjing
ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.
Wednesday 16 August 2017
Globalfoundries demos 2.5D HBM solution
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
Thursday 27 July 2017
TSMC, UMC offer higher prices to secure wafer supplies
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have recently secured 1-2 year supply contracts with Shin-Etsu and Sumco and offered higher prices...
Tuesday 25 July 2017
MediaTek to transfer 28nm chip orders to UMC
MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...
Friday 21 July 2017
Korea chipmakers looking to expand foundry biz
Samsung Electronics, Dongbu HiTek and SK Hynix have stepped up their foundry business expansions, which will as a group pose a threat to the existing major dedicated foundry houses...
Wednesday 19 July 2017
Upcoming Meizu Pro 7 series reportedly to utilize MediaTek chips
Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...
Wednesday 19 July 2017
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Monday 17 July 2017
Globalfoundries and VeriSilicon to enable single-chip solution for next-gen IoT networks
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
Monday 10 July 2017
Globalfoundries 22FDX attracts orders from Shanghai Fudan
Globalfoundries' 22nm FD-SOI process, dubbed 22FDX, has obtained orders from Shanghai Fudan Microelectronics, according to industry sources.
Monday 3 July 2017
Globalfoundries CEO predicts a golden decade for semiconductors
The semiconductor industry will enter a golden age in the next decade, driven by robust chip and memory demand for ultra-large data centers and artificial intelligence (AI) applications,...
Tuesday 27 June 2017
MediaTek shifts half of its 16nm chip orders away from TSMC, says report
Half of MediaTek's 16nm chip orders placed with Taiwan Semiconductor Manufacturing Company (TSMC) will be shifted to Globalfoundries, according to a report from Taiwan's TechNe...