Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have recently secured 1-2 year supply contracts with Shin-Etsu and Sumco and offered higher prices...
MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...
Samsung Electronics, Dongbu HiTek and SK Hynix have stepped up their foundry business expansions, which will as a group pose a threat to the existing major dedicated foundry houses...
Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
The semiconductor industry will enter a golden age in the next decade, driven by robust chip and memory demand for ultra-large data centers and artificial intelligence (AI) applications,...
Half of MediaTek's 16nm chip orders placed with Taiwan Semiconductor Manufacturing Company (TSMC) will be shifted to Globalfoundries, according to a report from Taiwan's TechNe...
IC foundries are gearing up for mass production of 7nm chips in 2018, as well as production for 7nm process technology using extreme ultraviolet (EUV), according to market observers...
Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...
IBM on June 5 announced that the company and its research alliance partners Globalfoundries and Samsung, and equipment suppliers have developed an industry-first process to build...