At the close of 2023, it's reported that TSMC and Samsung will delay the mass production of 4nm chips at their new fabs in the US from 2024 to 2025, posing a challenge to the Biden...

Intel has reportedly acquired 6 high-NA EUV lithography machines from ASML, which is scheduled for shipment in 2024, according to South Korean media outlets. Intel's fast adoption...

With Samsung Foundry, TSMC, and Intel entering mass production of 3nm GAA, 3nm FinFET, and Intel 4 processes in 2022-2023, the three major semiconductor makers are gearing up to develop...

After achieving breakthroughs in production technologies for high bandwidth memory (HBM) and 300-layer NAND flash chips, SK Hynix is accelerating the development of the next-generation...

Belgium-based Interuniversity Microelectronics Centre (IMEC), a world-renown research and innovation hub in nanoelectronics and digital technologies, signed an MOU on June 28 to intensify...

South Korean semiconductor chemical materials maker Dongjin Semichem has announced plans to develop a new generation of high-NA EUV photoresists to meet the demand to result from...

TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...

US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...

Samsung Electronics and Intel have both stepped up efforts to expand their respective foundry businesses, eyeing bigger slices of the global foundry market particularly in the advanced...

To quickly catch up with its two major rivals – TSMC and Samsung, Intel announced to adopt another ASML's High-NA...

Intel has made its first purchase order for ASML's TWINSCAN EXE:5200 system, marking the next step on the path to EUV 0.55 NA (High-NA) introduction.