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NEWS TAGGED HYBRID BONDING
Friday 13 October 2023
Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Tuesday 3 October 2023
Samsung, SK Hynix enhance memory packaging investments, eyeing explosive HBM demand to start in 2024
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
Thursday 21 September 2023
As HBM competition heats up, introduction schedule of 'hybrid bonding' receiving attention
With the increased prevalence of generative AI, the demand for High Bandwidth Memory (HBM) is rapidly rising, leading to heightened competition in stacking. For HBMs, a higher stack...