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Wednesday 7 August 2019
PCB makers increasing ABF substrate capacity
IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...
Wednesday 26 June 2019
Unimicron, Na Ya to gain from high-specs ABF substrates in 2H19
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Thursday 30 May 2019
China overtakes Japan as world No. 2 PCB supplier
Taiwan has been the leader in the global PCB sector in terms of production value and technology development, and China has grown rapidly to unseat Japan as the world's second largest...
Wednesday 15 May 2019
ABF substrate supply remains tight
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.
Friday 13 June 2014
Supply of any-layer HDI boards to remain in 2H14, says Compeq chairman
The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...
Friday 25 April 2014
IC substrate suppliers to compete for 20nm and below process orders in 2015
IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...
Thursday 13 September 2012
Taiwan makers begin to ship FPCBs, HDI boards for new iPhone
Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...
Friday 19 November 2010
Sources reveal some PCB suppliers for iPad 2
Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...
Thursday 21 October 2010
Nanya PCB to get more FC substrate backend orders from Intel on better yields
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...
Tuesday 27 October 2009
Topoint, Key Ware enter Japan drill bit supply chain
Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...
Monday 12 January 2009
Taiwan IC substrate supply chain seeing more outsourcing and material orders from Japan
Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.
Thursday 13 November 2008
Semco becomes top-two FC-CSP substrate supplier
Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research