Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.
Lip-Bu Tan, the founder of Cadence Design Systems and a prominent figure in tech venture capital, resigned abruptly from Intel's board of directors on August 19. This unexpected departure...
Taiwan-Asia Semiconductor Corp. (TASC), a specialist in sensing and light-emitting devices, is significantly increasing its investment in the wide bandgap power semiconductor market...
Leading panel makers AU Optronics (AUO) and Innolux are expected to end the year in the black, boosted by non-operating income as they sell their factories to TSMC and Micron, which...
Xpeng Inc. is looking for a manufacturing site in Europe, making it the latest Chinese electric vehicle maker seeking to mitigate the impact of import tariffs by building its cars...
The South Korean government is rolling out a "Super eul" initiative to foster companies in the materials, components, and equipment sectors. This ambitious plan includes targeted...
Hua Hong Group, one of China's two major semiconductor foundries, trails behind Chinese industry leader SMIC in terms of both capacity and market share, holding a global market share...
Intel's Sales and Marketing Group (SMG) reportedly plans to streamline its workforce and reduce marketing expenses, aiming to cut costs by over 35% by the end of 2024.
With TSMC expanding its presence in the United States, Japan, and Europe, many suppliers have followed suit, venturing abroad to establish new operations.
AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
Following a semiconductor collaboration with Malaysia, India further expanded its partnership with Singapore to include advanced manufacturing, semiconductors, aviation, and other...
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
