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Friday 31 May 2024
Taiwan M&A deals and transactions expected to hit new high in 2024, according to MAPECT
As Taiwan M&A and Private Equity Council (MAPECT) commemorates its 10-year anniversary with the release of the 2024 Taiwan M&A Whitepaper on May 29.
Friday 31 May 2024
Japan considering ways to provide additional financial resources to Rapidus
As previous subsidies of a total of JPY920 billion (nearly US$6 billion) may not be sufficient to help Rapidus achieve its goal of mass-producing 2nm chips, Japan's Ministry of Economy,...
Friday 31 May 2024
Skymizer unveils 'EdgeThought' AI ASIC chip IP, enabling Llama3 and Mistral models at the edge
Skymizer, a prominent Taiwan-based AI system software provider known for its compiler optimization solutions, has announced the release of EdgeThought, its new software-hardware co-design...
Friday 31 May 2024
Nvidia CEO engages significant Taiwanese CEOs to promote local AI supply chain
Nvidia CEO Jensen Huang revealed two months ago, at a dinner party for Taiwanese partners in Silicon Valley, that he considers himself Taiwan's ambassador. Taiwan is positioned as...
Friday 31 May 2024
With Nvidia taking lion's share of market profits, Intel's finances have struggled amidst AI boom
NVIDIA's latest financial report for the first quarter of fiscal year 2025 (February to April 2024) revealed record-breaking revenue for its data center division. Following a record-setting...
Friday 31 May 2024
Chinese CIS suppliers expand presence in high-end smartphone market
The Chinese semiconductor industry, including the CMOS Image Sensor (CIS) segment, is finding more room for development in the domestic market with the sudden rise of the Chinese...
Thursday 30 May 2024
Samsung's new chip chief seeks to rally troops after setbacks
The new head of Samsung Electronics Co.'s semiconductor division urged employees to work their way past challenges in the business, making his first remarks to staff after the surprise...
Thursday 30 May 2024
Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Thursday 30 May 2024
Malaysia plots US$5.3 billion roadmap to build advanced chip ecosystem
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Thursday 30 May 2024
Intel CEO to meet with key suppliers and partners in Taiwan
The list of companies attending Intel's gala dinner event, which will take place during CEO Pat Gelsinger's visit to Taiwan, has been leaked.
Thursday 30 May 2024
Apple iPhone order loss threatens Coherent's UK chip plant closure
US semiconductor manufacturer Coherent is facing the potential closure or sale of its 29,000-square-meter wafer fab in Newton Aycliffe, County Durham, UK.
Thursday 30 May 2024
Chinese AI chipmakers face US ban but remain optimistic
Top Chinese AI chipmakers SenseTime, iFlytek, and Biren have all been included in the US Department of Commerce's Entity List.
Wednesday 29 May 2024
Nvidia jumps to FOPLP for AI server chips amid CoWoS capacity strain
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Wednesday 29 May 2024
Samsung strengthens AI from three aspects: semiconductors, GenAI, home appliances
To establish its foothold amidst the AI wave, Samsung Electronics has been aggressively enhancing the competitiveness of its AI business through semiconductors, Generative AI, and...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research