According to the restructured accounting model of Intel Foundry (IF), it has been seeing continuous operational losses for three consecutive years from 2021 to 2023, totaling US$5.1...
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
TSMC today announced that the US Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding...
DRAM makers have temporarily stopped offering product quotes, signaling a likelihood that there will be major increases in prices in the wake of a strong earthquake that shook Taiwan...
According to the Semiconductor Industry Association (SIA), global semiconductor sales totaled US$46.2 billion in February 2024, up 16.3% from US$39.7 billion a year earlier.
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
After the 7.4 magnitude earthquake hit northeastern Taiwan, TSMC's speedy recovery to resume operation on the late evening of April 5 demonstrated the resilience and flexibility of...
Mega Networks, an Indian server solutions provider with almost 28 years of experience, is planning to bring out AI servers and enter the semiconductor packaging segment.
Japanese Prime Minister Fumio Kishida visited Japan Advanced Semiconductor Manufacturing (JASM), a Taiwan Semiconductor Manufacturing Company (TSMC) subsidiary in Kumamoto, Kyushu,...
Taiwan Semiconductor Manufacturing Company (TSMC), the world's leader in pure-play foundry, basically said the impact of the April 3 earthquake was minimal in a statement on the evening...
