Lam Research has announced what it claims is the world's first production-oriented Pulsed Laser Deposition (PLD) technique for next-generation MEMS microphones and Radio Frequency...
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Despite the restrictions imposed by the US ban, which prevent the Chinese market from accessing Nvidia's latest B200 GPU, Huawei's alternative GPU, albeit less powerful than the B200,...
Japan-based semiconductor material provider Dai Nippon Printing (DNP) will supply Rapidus with the photomasks for 2nm chips after mass production, scheduled for 2027.
In the fiercely competitive realm of the global lithography market dominated by ASML, Nikon is making strategic inroads. The renowned Japanese company is now supplying lithography...
Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Liteon Technology recently co-hosted its first Demo Day for its Liteon+ startup platform. The company presented the performance of five startups including PackAge+ and Elephantech.
Japan-based Toppan Holdings has shifted the production of components for CMOS image sensor components (CIS) from Japan to China, increasing local production by 40% as Beijing seeks...
