Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...

ByteDance Ltd. and Broadcom Inc. have discussed a potential collaboration on an AI processor to help bolster the TikTok parent's development of that technology.

Samsung and Intel are trying to overtake TSMC, but TSMC chairman C. C. Wei's answer to that challenge is: "No way!"

As the industry heavily invests in High Bandwidth Memory (HBM) DRAM, market insiders predicted a supply shortage for general DRAM.

In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...

These are the most-read DIGITIMES Asia stories in the week of June 17 – June 21.