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NEWS TAGGED IC SUBSTRATE
Thursday 24 February 2022
Unimicron in talks about ABF substrate orders for 2027-2030
Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...
Wednesday 23 February 2022
Unimicron to merge with SiP substrate specialist
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Monday 31 January 2022
Uneven chip supplies not necessarily all bad: Q&A with ChipMOS Technologies chair SJ Cheng
Taiwan's semiconductor packaging and testing sector has scored its best-ever business results over the past two years, with the display driver IC (DDI) backend segment also logging...
Wednesday 19 January 2022
Taiwan ABF substrate makers eyeing new profits with new capacities
Taiwan-based ABF substrate suppliers expect the activation of new production capacities later this year and in 2023 to boost their profits amid tight supplies, according to industry...
Wednesday 12 January 2022
Aspeed scores record business results for 2021
Taiwan-based remote server management SoC solution provider Aspeed Technology expects to post record profits in 2021 along with its revenues for the year surging 18.7% on year to...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Tuesday 28 December 2021
Semco reportedly to build new ABF substrate capacity in Vietnam to serve Intel
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Friday 24 December 2021
ABF substrate makers keep expanding production capacities
ABF substrate makers Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have added capital expenditure to keep expanding production capacities, according to the...
Wednesday 22 December 2021
EMC to issue bonds for capacity expansion on IC substrate CCLs
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...
Wednesday 22 December 2021
ABF substrate supply to see 20% shortage throughout 2022, says Unimicron
The supply of ABF substrates will continue to be at least 20% short of demand in 2022, and the crunch may start to ease only after most of new capacities at suppliers come online...
Monday 20 December 2021
Unimicron to increase 2022 capex on ABF substrate capacity for non-Intel clients
Taiwan's leading IC substrate maker Unimicron Technology has recently scaled up its capital expenses for 2022 to NT$35.858 billion (US$1.287 billion) from the originally planned level...
Friday 10 December 2021
Taiwan IC substrate makers poised to enjoy strong 4Q21
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are all poised to see their revenues peak for 2021 in the fourth quarter thanks to strong shipments for fulfilling...
Friday 26 November 2021
Highlights of the day: PCB, IC substrate equipment demand robust
Strong demand for PCBs and IC substrates is sending suppliers increasing capacity, which in turn is extending order visibility at equipment...
Friday 26 November 2021
PCB and IC substrate equipment makers see order visibility extended to 2H22
Taiwan-based equipment suppliers engaged in the PCB and IC substrate sectors have seen order visibility extended to the second half of next year, thanks to their clients increasing...
Friday 26 November 2021
Shortage of ABF substrates for notebook processors to widen in 2022
In the notebook processor supply chain, ABF substrates will be among certain components that will see shortage widen in 2022, which may tighten supply of notebook processors affecting...