The patent war surrounding gallium nitride (GaN) compound semiconductors continues to escalate. Recently, power component leader Infineon intensified its patent infringement case...
Gallium Nitride (GaN) semiconductors, having made a strong debut with fast chargers for consumer electronics, are now finding fresh opportunities in AI servers, data centers, and...
On July 23, 2024, Infineon Technologies AG expanded its ongoing lawsuit in the U.S. District Court for the Northern District of California, adding claims against Innoscience (Zhuhai)...
During the Infineon Tech Day held in Taiwan, Infineon Technologies, an integrated device manufacturer (IDM), announced the release of a new PSoC Edge line of microcontroller units...
Infineon Technologies is working to maintain its leadership in the power semiconductor industry by implementing measured strategies for power semiconductors and wide-bandgap (WBG)...
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...
Amkor Technology and Infineon Technologies have signed a Memorandum of Understanding (MoU) to jointly promote sustainability and decarbonization methods across their supply chain.
Chip manufacturing is the primary source of the carbon footprint generated by electronic devices. To address this, German chip giant Infineon plans to calculate the carbon footprint...
Chinese Gallium Nitride (GaN) IDM Innoscience is preparing to go public on the Hong Kong Stock Exchange (HKEX), despite continued losses and the possibility of future losses due to...
German IDM Infineon Technologies has officially launched new Power Supply Units (PSUs) integrating Silicon (Si), Silicon Carbide (SiC), and Gallium Nitride (GaN) materials to meet...
Infineon Technologies will supply Silicon Carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi's EVs, including the recently announced SU7, until...
Leading automotive IDMs are facing increasing competition, with STMicroelectronics (ST) trailing closely behind second-placed NXP Semiconductors, according to TechInsights.
Infineon Technologies recently announced a multi-year partnership with Amkor Technology, a leading provider of semiconductor packaging and test services. Both companies have agreed...
