Taiwan-based DRAM maker Winbond Electronics may have difficulties securing continued technological support from Qimonda, which could be unable to maintain its operations through out...
While Texas Instruments (TI), Infineon Technologies and Freescale Semiconductor are expected to be on the supplier lists of Nokia and Motorola for 2.5G handset chips next year, MediaTek...
Infineon has announced its new ultra-low cost dual-SIM platform. The XMM1028 is based on the X-GOLD102DS and is a cost optimized single baseband solution for dual-SIM platforms. Negating...
The industrial/medical sector has risen in importance at many semiconductor vendors over the last few years as suppliers have come to identify the market as dependable throughout...
LG Electronics (LGE), ambitiously eyeing the emerging markets, has placed orders with Arima Communications for at least 12 new 2.5G handsets, with shipments to reach as many as 10...
STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...
With MediaTek announcing that it is sampling its 3G WCDMA solution with customers at the end of 2008, the company joins the competition in the global 3G handset chipset market with...
The new iPhone 3G sports an evolutionary design that favors cost reduction instead of cutting-edge features, supporting Apple's goal of expanding its market share and achieving a...
With increasing IDM orders from vendors including STMicroelectronics, Infineon and NXP Semiconductors, as well as clients in Europe, IC testing house King Yuan Electronics Company...
