Infineon Technologies has announced that it has applied to voluntarily delist its American depositary shares (ADSs) from the New York Stock Exchange (NYSE). The company expects that...
The gut-wrenching downturn in the global automotive industry has spurred the shutdown of Systron Donner Automotive, the world's second-largest supplier of car quartz micro-electromechanical...
Infineon Technologies has sold more than 100 million chips for the so called ultra-low-cost handset segment. The X-GOLD101 (E-GOLDvoice) mobile communications chip is the second generation...
With the current president and CEO of Grace Semiconductor Manufacturing Corporation (GSMC) said to have been charged in a bribery case, industry sources in China have speculated that...
Apple is rumored to possibly be considering adding Broadcom to its iPhone supply chain, according to Taiwan OEMs who have seen Broadcom's baseband and RF chips on PCBs believed to...
The global power management (PW) and driver IC market will experience a revenue decline of around 3% in 2009, mainly due to the current slowdown in consumer spending, IMS Research...
Qimonda has announced that the company has arranged a financing package of 325 million euros (US$445.58 million) for the ramp up of its Buried Wordline technology. The rescue package...
The Taiwan DRAM industry has been constructed and developed progressively for over 10 years, playing a decisive role in the global semiconductor market, according to ML Chen, chairman...
Taiwan-based DRAM maker Winbond Electronics may have difficulties securing continued technological support from Qimonda, which could be unable to maintain its operations through out...
While Texas Instruments (TI), Infineon Technologies and Freescale Semiconductor are expected to be on the supplier lists of Nokia and Motorola for 2.5G handset chips next year, MediaTek...
Infineon has announced its new ultra-low cost dual-SIM platform. The XMM1028 is based on the X-GOLD102DS and is a cost optimized single baseband solution for dual-SIM platforms. Negating...
The industrial/medical sector has risen in importance at many semiconductor vendors over the last few years as suppliers have come to identify the market as dependable throughout...
LG Electronics (LGE), ambitiously eyeing the emerging markets, has placed orders with Arima Communications for at least 12 new 2.5G handsets, with shipments to reach as many as 10...
STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...
With MediaTek announcing that it is sampling its 3G WCDMA solution with customers at the end of 2008, the company joins the competition in the global 3G handset chipset market with...
