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Thursday 8 August 2024
SEMI Japan urges unified advanced chips packaging standards to ease capacity crunch
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
Wednesday 7 August 2024
Intel's telecommunications division likely to face brunt of Intel's massive cost-cutting
Intel recently released a disappointing earnings report, revealing declines in both revenue and operating margin. The company announced comprehensive cost-cutting plans, including...
Wednesday 7 August 2024
Intel 18A process on track for next-gen client and server chip production in 2025
Intel has announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and...
Monday 5 August 2024
Huawei reportedly to introduce shared memory for next PC chip
Huawei reportedly mimics Apple by designing a chip with shared memory to improve its chip performance amid US sanctions and develop its in-house chip infrastructure ecosystem.
Monday 5 August 2024
Intel's cost reduction plan only temporary fix amidst disappointing 2Q24
Intel reported a US$1.6 billion net income loss in the second quarter, a significant decline compared with the US$1.48 billion in net income it recorded during the same period in...
Monday 5 August 2024
What went wrong with Intel? Its backyard is on fire
Intel's recent announcement to cut 15% of its workforce (approximately 15,000 employees) and reduce capital expenditures to save US$10 billion may undermine its goal of reclaiming...
Friday 2 August 2024
Intel announces cost reduction plan, expects to reduce tile production outsourcing to TSMC in 2026
Intel has unveiled a cost reduction plan involving significant layoffs, substantial cuts in operating expenses, and a sharp reduction in capital expenditures (capex). The announcement...
Wednesday 31 July 2024
CoSAI establishment sees Intel, Google, and IBM joining
The Coalition for Secure AI (CoSAI), proposed by the global open standards organization OASIS Open, has been officially established. Its goal is to provide industry practitioners...
Wednesday 31 July 2024
Biden administration responds to packaging and testing industry as Amkor receives subsidies from CHIPS Act
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Monday 29 July 2024
Micron intros new data center SSD for AI workloads
Micron Technology has announced the release of the Micron 9550 NVMe SSD, which the company claims is the world's fastest data center SSD and an industry leader in AI workload performance...
Monday 29 July 2024
EU subsidies for fab construction progressing slowly; both TSMC and Intel yet to be approved
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
Monday 29 July 2024
Intel eyes local surging data center and PC markets amid Indian AI push
Amid a plan by India to invest heavily in GPUs to advance its national AI initiatives, Intel is optimistic about the potential in India's data center sector and is also eager to secure...
Monday 29 July 2024
TSMC to start using high-NA EUV tools for A14P in 2028
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
Monday 29 July 2024
Japan bets on back-end processes to resurrect chip industry, attracting investments from TSMC, Samsung, and Intel
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...
Monday 29 July 2024
Slow EU approval delays Intel and TSMC subsidies under European Chips Act
In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research