As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
TSMC said Thursday it plans to sell up to 152 million common shares of Vanguard International Semiconductor (VIS) to institutional investors through a block trade, reducing its stake...
Vanguard International Semiconductor said AI-driven demand has largely offset geopolitical and macroeconomic headwinds and will be the dominant force shaping semiconductor industry...
Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push...
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
LG Display is moving from research toward execution in the emerging glass interposer market, working with domestic glass-processing partners to apply its display manufacturing experience...
Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
