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NEWS TAGGED INTERPOSER
Friday 25 October 2024
Samsung reveals silicon capacitors and 3.5D packaging roadmap
Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...
Thursday 17 October 2024
Shin-Etsu Chemical enters semiconductor manufacturing equipment market with interposer-eliminating technology
Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...
Tuesday 30 July 2024
Amkor expects to mass produce organic interposers in early 2025
Amkor reported modest sales growth, primarily driven by surging demand for AI data centers and growth in the smartphone market. These positive factors offset declining sales in the...
Thursday 18 July 2024
SK Hynix on track to explore interposer-free HBM4 production
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
Tuesday 16 July 2024
SK Hynix reportedly partners with Amkor in supplying interposers
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
Friday 12 July 2024
Japan semiconductor material suppliers ramping up investments
Japanese companies are doubling down on investments in semiconductor materials, a sector where they already dominate the global market. This comes amidst generous government subsidies...
Tuesday 2 July 2024
Chinese manufacturers to benefit from CoWoS-like structures and TSMC order surplus
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
Friday 10 May 2024
Rapidus gears up for advanced packaging and chiplet technologies as it races to 2nm production
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
Thursday 2 May 2024
PSMC Tongluo fab receives interposer order to fulfill AI demand
PSMC, a Taiwan-based semiconductor foundry service provider, inaugurates its first 12-inch wafer fab in Miaoli, Taiwan on May 2. At the ceremony venue, PSMC chairman Frank Huang said...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research