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    Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations
    2min ago
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    Aug 3, 18:57
    NEWS TAGGED INTERPOSER
    Monday 13 July 2026
    Samsung develops glass interposer as TSMC expands packaging capacity

    Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

    Friday 15 May 2026
    TSMC to trim Vanguard International stake to 19% in block trade
    TSMC said Thursday it plans to sell up to 152 million common shares of Vanguard International Semiconductor (VIS) to institutional investors through a block trade, reducing its stake...
    Sunday 10 May 2026
    AI demand fills Vanguard's Singapore fab ahead of schedule
    Vanguard International Semiconductor said AI-driven demand has largely offset geopolitical and macroeconomic headwinds and will be the dominant force shaping semiconductor industry...
    Wednesday 6 May 2026
    VIS joins CoWoS chain with TSMC-backed Singapore interposer foundry
    Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push...
    Wednesday 1 April 2026
    TSMC eyes SiPh breakthrough as industry consensus forms
    TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Monday 26 January 2026
    LG Display pushes into glass interposers as Korean panel makers seek growth
    LG Display is moving from research toward execution in the emerging glass interposer market, working with domestic glass-processing partners to apply its display manufacturing experience...
    Saturday 3 January 2026
    Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
    Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
    Monday 22 December 2025
    AP Memory sets 2026 mass production timeline for S-SiCap discrete silicon capacitors

    AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation...

    Wednesday 17 December 2025
    Rapidus unveils glass interposer to challenge TSMC
    Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs...
    Thursday 2 October 2025
    CoWoS creates turning point for 12-inch SiC
    Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
    Thursday 4 September 2025
    Resonac launches JOINT3 alliance to develop next-gen semiconductor tech
    Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
    Thursday 14 August 2025
    TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
    Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its...
    Friday 23 May 2025
    IBM and Deca boost North American chipmaking with new advanced packaging line in Quebec
    According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM's advanced packaging plant...
    Wednesday 2 April 2025
    GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
    Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
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    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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