Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...

Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...

PSMC, a Taiwan-based semiconductor foundry service provider, inaugurates its first 12-inch wafer fab in Miaoli, Taiwan on May 2. At the ceremony venue, PSMC chairman Frank Huang said...