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Thursday 25 June 2026
TSMC-Amkor alliance jolts packaging map as ASE races to expand
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Thursday 25 June 2026
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
Thursday 25 June 2026
Taiwan-US tariff deal cuts auto parts duties to 15% and reshapes supply chains
Taiwan's agreement with the US to cap tariffs on auto parts at 15% is prompting suppliers to rethink production and shipping plans, with implications that extend beyond the island's...
Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...
Wednesday 24 June 2026
AI supply chain boom fuels Taiwan's investment, exports as GDP growth tops 10% outlook
Taiwan's economy is expected to maintain strong momentum through the second half of 2026, supported by accelerating AI-related investment, resilient exports, and robust demand across...
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

Tuesday 23 June 2026
Kaori's Kaohsiung plant targets 2027 output for AI cooling and green energy demand
Kaori Heat Treatment held a groundbreaking ceremony for its new plant at Kaohsiung's Ciaotou Science Park on June 23. Chairman Dr. Allen Wu led the management team at the event, joined...
Tuesday 23 June 2026
Micron and Anthropic partner to advance next-gen AI infrastructure

Micron and Anthropic have announced a strategic agreement to scale the infrastructure needed to support increasingly powerful AI models,...

Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development...
Tuesday 23 June 2026
Meta invests in India's CRED, taps founder Kunal Shah to lead WhatsApp

Meta Platforms has agreed to invest US$900 million in Indian fintech startup CRED and appoint its founder, Kunal Shah, as the new global...

Tuesday 23 June 2026
Japan puts robotics at heart of US$2.3 trillion chip revival

Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040,...

Monday 22 June 2026
India roundup: Apple's India manufacturing bet faces reminder of operational risks after Tata probe closure

India is accelerating its electronics manufacturing ambitions through AI infrastructure, semiconductor...

Monday 22 June 2026
MSScorps expands Taiwan investment again for silicon photonics

Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from...

Saturday 20 June 2026
Samsung weighs Boston Dynamics stake as humanoid AI race heats up

Samsung Electronics is reportedly reviewing the possibility of investing in Boston Dynamics, the US robotics company controlled by...