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Sunday 26 July 2026
Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection
This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...
Saturday 25 July 2026
89 fabs by 2030, 50 more by 2035: chip industry spreads risk through global collab

AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past...

Saturday 25 July 2026
Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...
Saturday 25 July 2026
South Korea unveils AI cooperation agenda as Nvidia partnerships expand
South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI Declaration" aimed at promoting international cooperation in artificial...
Friday 24 July 2026
Google raises capex outlook as compute demand stays tight, boosting Foxconn
Alphabet, Google's parent company, has raised its capital expenditure forecast to US$195-205 billion and signaled a significant increase again in 2027, while openly saying that AI...
Friday 24 July 2026
Product mix optimization boosts Sinbon 2Q26 net profit up 19%

Benefiting from product mix optimization and a higher contribution from industrial applications, connector maker Sinbon on July 23,...

Friday 24 July 2026
TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
Friday 24 July 2026
Samsung to break ground on Onyang HBM expansion in October, targets 2029 production
Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting...
Friday 24 July 2026
Trumpf builds EUV moat with 40 years of chip tech
AI demand is continuing to drive global semiconductor investment, lifting the importance of extreme ultraviolet (EUV) lithography once again. Trumpf, the German laser maker and key...
Friday 24 July 2026
Arizona lures chip boom with three key advantages
As TSMC expands its investment in Arizona to US$265 billion, the global semiconductor supply chain is accelerating its move into the state, transforming the long-known "Sunshine State"...
Friday 24 July 2026
Zhen Ding expands Thailand capacity, deepens industry-academia ties to develop PCB, chip talent
Major printed circuit board (PCB) manufacturer Zhen Ding Technology Group has been actively developing its manufacturing base in Thailand. The investment was launched in 2023 and began...
Friday 24 July 2026
TEEMA advances Mexico science park plan as Sonora offers visa and policy support
The Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) moved its event promoting investment in science parks forward on July 21 in Taipei, with Mexico's Sonora state...
Friday 24 July 2026
TEEMA unveils three-part plan for Mexico technology park to help small exporters expand
Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) on July 21 held an investment briefing in Taiwan on its Mexico science park plan, bringing together representatives...
Thursday 23 July 2026
Samsung creates CEO-led robotics unit to speed commercialization

Samsung Electronics has created a robotics business unit reporting directly to its chief executive, bringing strategy, technology development,...

Thursday 23 July 2026
Japan loosens fiscal reins for JPY370 trillion AI, semiconductor strategy

Japanese Prime Minister Sanae Takaichi's government has approved a sweeping economic strategy that relaxes long-standing fiscal constraints...