CONNECT WITH US
NEWS TAGGED INVESTMENT
Thursday 15 October 2026
Trump says Taiwan will buy 30% of LNG output from Alaska project; Taipei confirms plans but not final terms
US President Donald Trump said at a Republican rally in Alaska on Tuesday that Taiwan had agreed to buy 30% of liquefied natural gas (LNG) from a planned Alaska pipeline project over...
Thursday 15 October 2026
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Thursday 15 October 2026
Applied Materials CEO says agentic AI drives wafer demand
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
Thursday 15 October 2026
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Thursday 15 October 2026
TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...
Thursday 15 October 2026
Samsung, Applied Materials back startup targeting chip packaging warpage
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
Thursday 15 October 2026
Genius Electronic Optical secures US$150 million 3M investment for optical communications
Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a...
Thursday 15 October 2026
US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders
Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...
Thursday 15 October 2026
Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns
The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine...
Thursday 15 October 2026
Nvidia pledges US$250M in AI safety research to UK, CEO defends industry's approach
Nvidia will provide the UK with US$250 million worth of computing resources over five years to support AI safety research, as CEO Jensen Huang defended the industry's ability to manage...
Thursday 15 October 2026
US solar import price floor faces four challenges as December deadline approaches
The US is seeking to improve the competitiveness of domestic solar manufacturers and attract overseas investment through minimum import price requirements for solar products. However,...
Thursday 15 October 2026
Murata eyes earlier MLCC expansion as AI server demand surges
Murata Manufacturing is considering additional investment and an earlier expansion of multilayer ceramic capacitor (MLCC) capacity as demand from AI servers accelerates. The company...
Thursday 15 October 2026
Dell CEO urges AI growth without sacrificing safety
As AI investment continues to expand, concerns are mounting over whether capital spending can translate into real revenue and whether data center construction is becoming excessive...
Wednesday 14 October 2026
Tata's flagship chip fab faces pressure from its own shareholders
Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses...
Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...