US humanoid robotics startup Agility Robotics announced it will list on the Nasdaq as early as September 2026, which would make it the first publicly traded humanoid robotics company...
Amazon on June 25 announced an additional US$13 billion investment in India's AI and cloud infrastructure by 2030, the third major commitment the company has made in as many years...
Tai Asia Semiconductor's latest annual meeting highlighted a broader shift that could matter for investors and technology supply chains worldwide. The company said it is absorbing...
GlobalFoundries (GF) is positioning its Singapore operations as a core hub for the emerging era of physical AI, as the chipmaker expands investment in manufacturing capacity and next-generation...
The EU currently hosts roughly 5% of the world's AI compute capacity. The US holds close to 75%. McKinsey projects European data center demand will grow from 10 GW of IT load in 2024...
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
During the launch event for the company's new scooter model "Luna," Gogoro CEO Henry Chiang said that the long-term goal is to become a sustainable and healthy enterprise, while also...
Ability Enterprises said it plans to increase its exposure to Agility Robotics after the robot maker disclosed plans for a Nasdaq listing via a SPAC. The move underscores rising demand...
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
Taiwan's agreement with the US to cap tariffs on auto parts at 15% is prompting suppliers to rethink production and shipping plans, with implications that extend beyond the island's...
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...
Taiwan's economy is expected to maintain strong momentum through the second half of 2026, supported by accelerating AI-related investment, resilient exports, and robust demand across...
