CONNECT WITH US
NEWS TAGGED INVESTMENT
Thursday 22 August 2024
Foxconn announces fresh investment across continents
According to Bloomberg, Foxconn has announced a total investment of US$830 million in its overseas operations across Europe, Mexico, the US, and India through four corporate...
Thursday 22 August 2024
TSMC's German fab set to offer job opportunities and promote wafer ecosystems in Europe
Dresden officially welcomed the construction of a new wafer fab by TSMC with a groundbreaking ceremony on August 20.
Wednesday 21 August 2024
AWS makes major investment in Taiwan, highlights cloud computing's role in economic growth
Amazon Web Services (AWS) made a significant investment in Taiwan by announcing the establishment of a new AWS region infrastructure in June, aimed at connecting local startups and...
Wednesday 21 August 2024
TSC expands disilane market share
Taiwan Specialty Chemicals (TSC) has gradually expanded its share of the global disilane market, which is dominated by its Japan- and France-based counterparts.
Tuesday 20 August 2024
ESMC breaks ground on Dresden fab
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
Tuesday 20 August 2024
IPC industry optimistic on growth in 2H24 due to market stabilization
Due to several factors such as inventory de-stocking and investment delays caused by weak economic environments, many industrial PC (IPC) companies faced declines in the first half...
Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Monday 19 August 2024
India roundup: Indian IC design startup seeks six automotive contracts and eyes mid-term chipmaking investment
L&T Semiconductor Technologies is on its way to bag IC design orders in the booming Indian semiconductor market. India's wearable shipments fell for the first time amid a lack...
Monday 19 August 2024
TI to receive up to US$1.6 billion in CHIPS Act funding
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
Friday 16 August 2024
Indian IC design startup seeks six automotive contracts and eyes mid-term chipmaking investment
L&T Semiconductor Technologies, an Indian startup set up less than a year ago, expects to begin developing chips for six automobile companies and eventually venture into the chipmaking...
Friday 16 August 2024
Applied Materials upbeat despite Intel's capex cuts; expects strong Chinese demand for packaging and testing despite lower sales contribution
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Thursday 15 August 2024
Foxconn discusses progress of 3+3 strategy, anticipates returns on semiconductor investments by late 2024
Foxconn held an earnings call on August 14, where it discussed the progress of its 3+3 development strategy.
Thursday 15 August 2024
TPK reports strong 2Q24 growth, aims for breakeven in 2024 driven by energy storage systems
TPK, a leading panel manufacturer, reported a substantial improvement in its financial performance for the second quarter of 2024. The company narrowed its core business losses to...
Thursday 15 August 2024
Foxconn chairman visits India again
As Foxconn revealed its second-quarter results in Taiwan on August 14, its chairman, Young Liu, visited India to meet with Indian Prime Minister Narendra Modi for the second time...
Wednesday 14 August 2024
TSMC approves US$29.6 billion capex for capacity expansions, tech upgrades
TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...