According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
According to the IDC Worldwide Quarterly Enterprise Infrastructure Tracker, buyer and cloud deployment, spending on compute and storage infrastructure products for cloud deployments,...
Japan's spending on edge computing is expected to reach US$12 billion (JPY1.6 trillion) in 2024, an increase of 12.3% over 2023, according to the IDC Worldwide Edge Spending Guide.
Chinese EV maker BYD plans to increase investment in its Brazilian plant by over 80% to accelerate construction. The factory is located in the Bahia state, northeast of Brazil, and...
Contract electronics vendors Hon Hai Technology Group (Foxconn) and Pegatron, as well as ODMs including Quanta Computer, Compal Electronics, and Wistron, have maintained their accelerated...
The US plans to award more than $6 billion to Samsung Electronics Co., helping the chipmaker expand beyond a project in Texas it has already announced, according to people familiar...