First-tier smartphone brands such as Apple and Samsung Electronics have begun adopting time of flight (ToF) technologies in their new smartphones, which is expected to boost the penetration...
US-based II-VI is expected to enter the supply chain for Apple's next-generation iPhones by fabricating VCSEL chips for time-of-flight (ToF) LiDAR scanners, according to industry...
Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...
Unitech Printed Circuit Board expects to post a revenue increase of 20-30% in 2021 as shipments for new orders and new clients will ramp up steadily, particularly in the second half...
Taiwan's top test interface specialist Chunghwa Precision Test Tech (CHPT) and TSMC's re-invested backend house Xintec are both optimistic about their revenue prospects for fourth-quarter...
Component shipment momentum for iPhone 12 series continues to strengthen, with order visibility for VCM (voice coil motor) components for iPhone 12 Pro and Pro Max models clear through...
IC testing solution provider Chunghwa Precision Test Tech (CHPT) and 3D sensor components packager Xintec have posted impressive revenue gains for the first three quarters of 2020...
GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone...
LeddarTech, a Canadian-based developer of environmental sensing solutions for use in ADAS (advanced driver assistance system) and AV (autonomous vehicles), sees strong prospects for...
GaAs foundry Win Semiconductors and other Taiwan-based III-V semiconductor players are ramping up their output for new smartphones, with order visibility for the fourth quarter strengthened,...
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has been stepping up its deployment in the...
GaAs foundry Win Semiconductors continues to enjoy a strong influx of orders for 5G PA and VCSEL components with clear order visibility through the fourth quarter, despite no orders...
CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...
Taiwan's III-V semiconductor supply chain players including Win Semiconductors and Visual Photonics Expitaxy (VPEC) are poised to benefit from growing demand for RF, PA and ToF LiDAR...
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
