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Thursday 24 May 2018
Samsung unveils plan for 3nm process
Samsung Electronics has disclosed its comprehensive process technology roadmap updates down to 3nm at the annual Samsung Foundry Forum in the US.
Tuesday 24 April 2018
Andes silicon IP chip shipments to hit 800 million mark in 2018
Taiwan-based CPU IP provider Andes expects to see shipments of its silicon IP chips hit the 800 million mark in 2018, according to company president Frankwell JM Lin.
Tuesday 27 March 2018
Macronix NOR chips adopted for new STMicro MCU
Macronix International has announced that STMicroelectronics is using Macronix International's 8-bit I/O serial NOR flash memory for ST's new STM32L4+ microcontroller discovery kits...
Friday 23 March 2018
Samsung intros 10nm AP for high-end smartphones
Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.
Friday 23 February 2018
Integrated circuit technology advances continue to amaze, IC Insights finds
The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money, according...
Monday 12 February 2018
SMIC to enter volume production of 28nm HKMG chips in 2H18
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) is scheduled to enter volume production of chips fabricated using 28nm HKMG and HKMG+ processes in the...
Friday 9 February 2018
Globalfoundries 22FDX process to attract more orders, says company executive
After securing orders from STMicroelectronics, Globalfoundries' 22nm FD-SOI (22FDX) process is being evaluated by hundreds of potential customers looking to use a more advanced fully-depleted...
Wednesday 20 December 2017
X-FAB introduces new low-power eFlash block optimized for energy harvesting & IoT devices
X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler. Both are based on the...
Friday 10 November 2017
Andes Technology joins Globalfoundries FD-SOI ecosystem
Processor IP provider Andes Technology has teamed up with Globalfoundries to provide low-power solutions for the foundry's 22nm FD-SOI process technology to jointly deepen their deployment...
Friday 13 October 2017
ACTT complete IoT solutions available on SMIC 55nm eFlash platform
Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...
Wednesday 27 September 2017
AMD to launch 12nm Ryzen in February 2018, says mobo makers
AMD has informed its partners that it plans to launch in February 2018 an upgrade version of its Ryzen series processors built using a 12nm low-power (12LP) process at Globalfoundries,...
Tuesday 26 September 2017
Samsung ready to mass produce MRAM chips using 28nm FD-SOI process
Samsung Foundry will soon be ready to enter mass production of magnetoresistive random-access memory (MRAM) chips built using 28nm fully depleted silicon-on-insulator (FD-SOI) process...
Wednesday 13 September 2017
QuickLogic offers eFPGA technology on SMIC 40nm low leakage process
Semiconductor Manufacturing International (SMIC) and QuickLogic have announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm low leakage...
Wednesday 30 August 2017
Qualcomm, Himax jointly develop 3D depth sensing solution
Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...
Thursday 24 August 2017
Qualcomm Snapdragon 835 chip powers Samsung Galaxy Note8
Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...