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Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

Thursday 10 September 2026
Samsung SDS partners with OpenAI and Anthropic in AI push
Samsung SDS used its REAL Summit 2026 to unveil a "multi-dimensional AI full stack" strategy, expanding its AI business from enterprise IT and cloud adoption into enterprise AI agents,...
Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation...
Thursday 10 September 2026
China gets an early shot at the next SiC power-chip cycle

Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

Thursday 10 September 2026
Beyond the stage, can XPeng's EV playbook scale humanoid robots?
As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
Thursday 10 September 2026
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Thursday 10 September 2026
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

Thursday 10 September 2026
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR...
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
Thursday 10 September 2026
STMicro sees AI sales accelerating as factory transfers hold key to margin recovery
STMicroelectronics expects rapidly expanding AI infrastructure sales and stronger automotive demand to support growth into 2027, but its largest gross-margin gains will depend on customer...
Thursday 10 September 2026
Flex's EPC Power deal points to a broader shift in AI infrastructure
Flex has recently agreed to buy US power conversion specialist EPC Power for US$4.4 billion, a move that highlights how competition in AI infrastructure is extending beyond servers...
Wednesday 9 September 2026
Huaqin signs Nanchang projects as robotics push widens
Huaqin Technology has signed two new projects in Nanchang High-tech Zone, expanding the smart-hardware ODM group's local manufacturing base into embodied-AI robotics and data collection,...
Wednesday 9 September 2026
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes

Kioxia has ruled out deeper manufacturing ties with SK Hynix while resisting another round of aggressive NAND price increases, leaning...

Wednesday 9 September 2026
Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached
Washington has converted the largest federal bet yet on quantum computing from a promise into a contract, and it is taking ownership in return. On Sept. 8, the US Department of Commerce...
Wednesday 9 September 2026
CXMT's 10% DRAM share intensifies debate over South Korea's 52-hour workweek

China's rapid advance in DRAM is intensifying debate in South Korea over whether rigid working-hour rules could make it harder to preserve...