中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    CXMT valuation gap highlights uncertainty over China’s DRAM push
    9h 47min ago
    Interview: Memory makers’ expansion drives up material costs and exposes FOUP shortages
    9h 47min ago
    BYD accelerates in-house chip push with 4nm Xuanji A3
    9h 47min ago
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    9h 47min ago
    L&F Plus ships first samples from South Korea’s first LFP cathode mass-production line
    9h 49min ago
    NEWS TAGGED MANUFACTURING
    Monday 3 August 2026
    Renesas plans to phase out Takasaki factory production and expand R&D focus

    Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening...

    Monday 3 August 2026
    xLight bets on EUV light source, eyes ASML deal
    The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization...
    Monday 3 August 2026
    Taiwan manufacturing business climate improves in June, headlined by electronics sector
    Taiwan's manufacturing climate improved in June 2026, with the electronics sector once again showing the clearest visibility, according to the Taiwan Institute of Economic Research...
    Monday 3 August 2026
    India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

    India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

    Monday 3 August 2026
    India expands chip talent pipeline amid surging global chip demand
    India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply...
    Monday 3 August 2026
    Dixon sees mobile, IT hardware, and component push lift export and margin outlook

    Dixon Technologies said its push into displays, camera modules, SSDs, and telecom hardware could deepen domestic value addition, even...

    Monday 3 August 2026
    Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
    US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After...
    Monday 3 August 2026
    Rising component costs, new Indian incentives, and export push shape Dixon's outlook
    Dixon Technologies said rising component prices pressured margins in the first quarter of fiscal 2027. Still, strong order inflows, a shift toward higher-value manufacturing, and new...
    Monday 3 August 2026
    Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
    Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
    Monday 3 August 2026
    India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

    India is expanding its semiconductor ambitions through new R&D centers, indigenous design...

    Monday 3 August 2026
    FICG launches Singapore-Malaysia dual-core strategy
    FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
    Monday 3 August 2026
    Holtek raises MCU prices by up to 20% as wafer and OSAT costs continue climbing
    Microcontroller unit (MCU) supplier Holtek Semiconductor has confirmed a broad price increase across its entire microcontroller portfolio, marking its first company-wide adjustment...
    Sunday 2 August 2026
    TASA opens space startup base to push Taiwan toward satellite ODM
    The Taiwan Space Agency (TASA) opened its new space startup accelerator, TASA iSPARK, on July 31 at National Yang Ming Chiao Tung University's Boai campus in Hsinchu. The center said...
    Sunday 2 August 2026
    Pittsburgh, Switzerland experts challenge Taiwan to move beyond robotics hardware
    As AI shifts toward agentic and physical applications, industry observers say competition will no longer hinge on hardware manufacturing alone, but on the ability to integrate hardware...
    Saturday 1 August 2026
    Thintronics wins proposed US CHIPS incentives for advanced substrate technology
    Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
    1/135 pages
    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
    reportAIglasses