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Thursday 23 April 2026
Interview: Seiko Epson outlines engineered future vision for 2035 amid geopolitical challenges
Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims...
Thursday 23 April 2026
Innos lists on OTC market, leveraging probe card demand wave with three major growth engines
Probe card full-line automation equipment supplier Innostar Service (Innos) has been listed on the over-the-counter (OTC) market on April 22. Looking ahead, Innos stated that AI applications...
Wednesday 22 April 2026
Analysis: Apple's new CEO has a secret robot team — and big plans for your home
Apple has officially announced that John Ternus will succeed Tim Cook as CEO. Given Ternus's deep hardware background, product innovation at the hardware level is widely expected to...
Wednesday 22 April 2026
Column: US drone industry learns from Ukraine's low-cost, rapid production
"The drone is not the weapon. The infrastructure to build it is." This statement, made by Ukrainian president Volodymyr Zelenskyy on March 31, 2026, encapsulates the direction of recent...
Wednesday 22 April 2026
Applied Materials announces Advantest as innovation partner for EPIC platform in Silicon Valley
Leading materials engineering in the semiconductor industry, Applied Materials, announced today that Advantest Corporation, a leading semiconductor test equipment supplier, will join...
Wednesday 22 April 2026
China pledges to stabilize memory chip supply as industrial growth and AI-driven manufacturing expand
China's industrial economy posted steady first-quarter 2026 growth, driven by strong performance in high-tech manufacturing and broad sectoral expansion, according to Ministry of Industry...
Wednesday 22 April 2026
Commentary: Apple CEO change sounds alarm for China suppliers
Apple has named hardware engineering chief John Ternus as chief executive, replacing Tim Cook after 15 years — a move that signals a strategic shift. While succession talk had...
Wednesday 22 April 2026
Apple's US$4 trillion leadership transition: will decision-making return to engineers?
Apple officially announced on April 21, 2026, that Senior Vice President of Hardware Engineering John Ternus will take over as CEO starting September 1 this year, while current CEO...
Wednesday 22 April 2026
Taiwan suppliers expect renewed focus on innovation under John Ternus
Apple's appointment of hardware engineering senior vice president John Ternus to succeed Tim Cook as CEO in September 2026 signals shifts in product strategy and supplier relations...
Wednesday 22 April 2026
Micron's Sanand ramp shifts India chip debate from milestone to manufacturing system
Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global...
Wednesday 22 April 2026
Analysis: Tesla's chip ambitions drive a wedge between Samsung and Intel
Tesla's Terafab project is accelerating, with the company targeting substantial in-house chip production to support autonomous driving, robotaxis, humanoid robots, and AI infrastructure...
Tuesday 21 April 2026
Commentary: Honor's smartphone engineering enters robotics, testing Unitree's lead

At a humanoid robot half-marathon in the Beijing Economic-Technological Development Area (BDA or E-Town), Honor swept the top three positions...

Tuesday 21 April 2026
Qualcomm Chief reportedly seeks memory and manufacturing deals in South Korea

Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit...

Tuesday 21 April 2026
Taiwan has more than 260,000 job vacancies, with manufacturing accounting for 32.4%
Taiwan's artificial intelligence (AI) servers and advanced-process chip manufacturing businesses are booming, with related manufacturing industries also benefiting. According to a...
Tuesday 21 April 2026
China amping up DRAM integration: GigaDevice expands into DRAM through CXMT tie-up
GigaDevice is moving into DRAM through a KRW1 trillion (US$680 million) related-party deal, combining CXMT's manufacturing capacity with its own sales network in a move that could...