The White House has announced a significant shift in US trade policy, asserting that access to the American market is "a privilege, not a right." The Trump administration emphasized...
For the first 45 years after Intel's founding, from its first CEO Robert Noyce to its fifth, Paul Otellini, the company focused on perfecting the IDM (integrated device manufacturing)...
Jabil has introduced advanced transceivers capable of transmitting data at speeds reaching 1.6 Terabits per second, aimed at addressing the increasing demand from sectors such as...
AUO Display Plus, a subsidiary of AUO, and E Ink Holdings have signed a term sheet to form a joint venture focused on scaling up the production of large-format ePaper modules. Backed...
During China's peak prosperity, Taiwan managed to survive under significant pressure. Now, freed from direct Chinese constraints, Taiwan continues to navigate challenges alongside...
Goertek, a leading Chinese electronics manufacturer, is expanding its footprint in Vietnam with a proposed VND9,717 billion (approx. US$391 million) investment while also formalizing...
Foxconn is broadening its third-party environmental, social, and governance audit program to nine facilities across China, Vietnam, Malaysia, India, and Mexico in 2024, as the iPhone...
Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory...
Foxconn (Hong Hai) revealed that its Indian subsidiary will procure equipment from Apple's subsidiary, signaling an expansion of Apple product production in India, which is rapidly...
Rapidus, a Japanese company focused on semiconductor innovation, officially opened its first facility, IIM-1, in Chitose City, Hokkaido, on April 1, 2025. Aiming to advance in the...
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
LG Innotek is expanding its focus beyond camera module manufacturing and is preparing to venture into the field of next-generation glass substrates. The company has revealed its intention...
Three months into 2025, Apple's senior leadership is back in China. CEO Tim Cook posted "Hello, Beijing" on Weibo, marking his fourth visit in just over a year. COO Jeff Williams...
Taiwan Semiconductor Manufacturing Company (TSMC) is poised to commence mass production of its 2-nanometer (nm) chips in the second half of 2025 as scheduled, with customer demand...
