Soaring memory procurement costs are pushing smartphone makers to pass expenses on to consumers. As artificial intelligence (AI) infrastructure expansion continues to squeeze global...
Japanese companies sharply reduced their footprint in China over the past two years, with the number operating there falling 22.4% from 13,034 to 10,118 as of the end of June 2026,...
ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...
Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion...
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than...
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production...
To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme...
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment...
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...
Infineon Technologies officially inaugurated a new backend manufacturing site in Samut Prakan, south of Bangkok, on October 1, expanding the German chipmaker's production network in...
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
Tata Electronics, Apple's contract manufacturing partner, provided INR612.8 billion (US$6.38 billion) in corporate guarantees on behalf of its subsidiaries in fiscal 2026 as it expanded...
