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Monday 3 August 2026
Rising component costs, new Indian incentives, and export push shape Dixon's outlook
Dixon Technologies said rising component prices pressured margins in the first quarter of fiscal 2027. Still, strong order inflows, a shift toward higher-value manufacturing, and new...
Monday 3 August 2026
Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design...

Monday 3 August 2026
FICG launches Singapore-Malaysia dual-core strategy
FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
Monday 3 August 2026
Holtek raises MCU prices by up to 20% as wafer and OSAT costs continue climbing
Microcontroller unit (MCU) supplier Holtek Semiconductor has confirmed a broad price increase across its entire microcontroller portfolio, marking its first company-wide adjustment...
Sunday 2 August 2026
TASA opens space startup base to push Taiwan toward satellite ODM
The Taiwan Space Agency (TASA) opened its new space startup accelerator, TASA iSPARK, on July 31 at National Yang Ming Chiao Tung University's Boai campus in Hsinchu. The center said...
Sunday 2 August 2026
Pittsburgh, Switzerland experts challenge Taiwan to move beyond robotics hardware
As AI shifts toward agentic and physical applications, industry observers say competition will no longer hinge on hardware manufacturing alone, but on the ability to integrate hardware...
Saturday 1 August 2026
Thintronics wins proposed US CHIPS incentives for advanced substrate technology
Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
Friday 31 July 2026
Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
Tesla CEO Elon Musk has denied a Wall Street Journal report on an internal plan within Tesla to prepare for a possible separation of its China operations. Despite his rebuttal,...
Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

Friday 31 July 2026
Rising smartphone prices are reshaping purchase plans in India
Rising smartphone prices in India are changing how consumers plan purchases, with wider implications for brands, retailers, and buyers worldwide. Counterpoint said many shoppers are...
Friday 31 July 2026
Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals

China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed...

Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
India's first telecom manufacturing zone to land in Madhya Pradesh

India has moved to build a major telecom manufacturing hub in Gwalior, a step that could reshape supply chains, investment flows, and...

Friday 31 July 2026
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...