Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up...
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
Days before preorders open for Apple's first foldable smartphone, the iPhone Duo, Apple Chief Operating Officer Sabih Khan visited China to inspect its supply chain. On October 11,...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external...
