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Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...
Thursday 15 October 2026
US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders
Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...
Thursday 15 October 2026
StarSeeds, Kaga Electronics target December 2026 AI server production in Japan
Kaga Electronics and AI infrastructure provider StarSeeds have signed a basic contract manufacturing agreement to produce AI servers at a partner facility in Japan, targeting mass...
Thursday 15 October 2026
Auden expects stronger growth in 2027, sees satellite industry taking another 2–3 years to gain momentum
RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's...
Thursday 15 October 2026
Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns
The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine...
Thursday 15 October 2026
Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
Applied Materials targets AI-driven semiconductor equipment growth through 2030
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Thursday 15 October 2026
Fujifilm to expand Arizona semiconductor materials output
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Thursday 15 October 2026
Taiwan solar manufacturers turn to US market as domestic approvals stall, low-cost imports intensify
Taiwan's solar manufacturers are increasingly looking to the US market as slowing approvals for large-scale domestic solar projects, limited rooftop installation capacity, and competition...
Thursday 15 October 2026
Topco eyes Idaho base as North American chip expansion accelerates
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
Wednesday 14 October 2026
300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Wednesday 14 October 2026
BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders

China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising...

Wednesday 14 October 2026
AI computing demand drives water management integration at Tianyi
Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...