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Friday 18 October 2024
TSMC Denies Huawei Chip Allegations; Industry Insiders Weigh In
Rumors have surfaced that the U.S. Department of Commerce is investigating whether Taiwan Semiconductor Manufacturing Company (TSMC) violated U.S. export regulations by producing...
Friday 18 October 2024
ASML's 3Q24 report reveals diverging paths in wafer manufacturing
Since ASML reported a slowdown in semiconductor manufacturing equipment orders, over EUR 60 billion (US$65.3 billion) of the firm's market value has evaporated, prompting the market...
Friday 18 October 2024
Infinera secures US$93 million CHIPS Act funding to expand photonic chip production and packaging
The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment...
Friday 18 October 2024
Japan-Taiwan's urban compact EV Lean3 to enter production
Through new fundraising, Japan-Taiwan electrical vehicle (EV) manufacturing company Lean Mobility has achieved a cumulative funding of JPY4.6 billion (US$30.8 million), allowing it...
Friday 18 October 2024
Taiwan targets low-carbon power to fuel industrial growth
Reliable access to low-carbon and zero-carbon energy has become a top priority for companies investing in manufacturing facilities in Taiwan. With rising global pressures to combat...
Thursday 17 October 2024
Adani reportedly talking with more Israel firms in semiconductor foray
After a partnership with Israel-based Tower Semiconductor for a wafer fab in India, the Adani Group is reportedly talking with two large Israel-based nich technology firms to form...
Thursday 17 October 2024
China Shock 2.0: global shipping rates signal end of overcapacity or new slowdown?
Amid sluggish domestic consumption and waning investment, China's manufacturing overcapacity—the vast output of the "world's factory"—is increasingly offloaded overseas...
Thursday 17 October 2024
Shin-Etsu Chemical enters semiconductor manufacturing equipment market with interposer-eliminating technology
Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...
Thursday 17 October 2024
MKS' Atotech to participate in TPCA Show and IMPACT 2024
Atotech, MKS Instruments' globally leading brand in surface-finishing solutions, will participate in one of the most important PCB events, the 25th Taiwan Circuit Industry...
Wednesday 16 October 2024
Samsung Galaxy S25 faces AP choice dilemma, with early November as final deadline
Samsung Electronics is currently grappling with the choice of application processors (AP) for its Galaxy S25 series, but time is running out to make the final decision.
Wednesday 16 October 2024
Wolfspeed secures US$750 million funding for US SiC production expansion
Wolfspeed, a US-based silicon carbide (SiC) chipmaker, has secured up to US$750 million in federal funding to construct a new wafer plant in North Carolina and expand its New York...
Wednesday 16 October 2024
Digital twins and AI advance self-driving technologies, says ASMPT
A growing number of companies are adopting digital twin technology to build highly accurate virtual models that mirror the real world, offering the automotive industry a new solution...
Wednesday 16 October 2024
Taiwan's 90% AI server market share at risk as manufacturers expand globally
The Ministry of Economic Affairs released the latest statistics on server production on October 15, highlighting Taiwan's strong position in the global server manufacturing industry...
Wednesday 16 October 2024
India kicks off 8th India Mobile Congress
India kicked off the 8th India Mobile Congress (IMC) on October 15, 2024, marking a pivotal event that underscores the country's ambition to become a powerhouse in mobile phone manufacturing...
Wednesday 16 October 2024
TCB packaging crucial in AI and HPC applications, says ASMPT
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research