Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
The Indian finance ministry lauded development in the mobile phone manufacturing ecosystem thanks to Apple suppliers, reducing import taxes benefiting Apple.
As Taiwan's manufacturing industry diversifies its supply chain in accordance with the China+1 strategy and the government's Southbound policy, it has been relocating factories to...
The Japanese government is taking significant steps to support Rapidus in its efforts to become a global leader in semiconductor manufacturing. This includes providing financial support,...
As Narendra Modi enters his third term as India's Prime Minister, the country is reportedly expected to adopt a somewhat softer stance on its economic ties with China by easing its...
Chinese foundries have prioritized orders from domestic customers, resulting in limited availability of fab capacity for others particularly Taiwan-based ones targeting the Chinese...
A high official of the US Agency for International Development (USAID) has recently urged Mexico to significantly increase investment in its semiconductor industry over the next two...
Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Intel has confirmed that part of its European investment project has been shelved due to economic reasons, highlighting the chipmaker's challenges in its foundry business, which relies...
Onsemi has announced a landmark supply agreement with Volkswagen (VW) - the world's second-largest automaker - to provide a complete power box solution for its next-generation electric...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...