Celebrating the 50th anniversary of Hon Hai Corporation, Hon Hai Research Institute held the AI NExT Forum with the theme of "50 Years-New Era of Wisdom: Generative AI and Future...
AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V...
Chen Nanxiang, chairman of Chinese memory company Yangtze Memory Technology Corp (YMTC), recently said during an interview with China Global Television Network (CGTN) that he expects...
Taiwan's offshore wind power industry, once heralded as a cornerstone of the country's green energy transition, is now grappling with significant challenges. Policy shifts and supply...
Inspur, a Chinese server manufacturer, recently denied a Reuters report, stating it has no collaboration with Nvidia on designing a B20 AI chip based on the Blackwell architecture...
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy...
AI PCs are not just a passing trend, according to Acer COO Jerry Kao. He believes that AI will drive PC purchases among consumers who weren't previously considering an upgrade, as...
Disappointing results from NXP Semiconductors in its latest financial report may indicate that car manufacturers are becoming more conservative and the development of battery electric...
Although initial demand for HPC and AI smartphone chips is expected to remain strong as the traditional peak season approaches, recent observations indicate potentially lower-than-expected...
The prime season for the stocking of new products is rapidly approaching, and the outlook for Taiwan's export orders is optimistic, market sources believe.
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
China has intensified its pursuit of IC self-sufficiency, but efforts differ for automotive microcontroller units (MCUs) and MOSFETs, according to industry sources.
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
A senior executive from a leading China-based NAND flash provider expressed optimism about the explosive growth potential of the Chinese semiconductor market, attributing this surge...
