Kaynes SemiCon is strengthening its position in the outsourced semiconductor assembly and test (OSAT) market, moving closer to securing new customers from Japan and the US as part...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
Founded in 1983, Hushan Autoparts has been a global leader in manufacturing automotive door handles for the aftermarket (AM) sector for over 40 years. In 2018, the company encountered...
The increasing adoption of application-specific integrated circuits (ASICs) for artificial intelligence (AI) has sparked discussions about potential competition to Nvidia's GPU market...
The global automotive industry is undergoing another wave of restructuring, with the trend of modular platforms gaining momentum. In response, Gogoro is set to implement strategies...
Nikon plans to introduce a new ArF immersion lithography system platform in fiscal year 2028 (April 2028 - March 2029) that offers compatibility with ASML equipment, marking a strategic...
Under new leadership, Gogoro has unveiled its strategic direction, suggesting a possible withdrawal from India's electric two-wheeler market in favor of a targeted expansion in Vie...
China recently unveiled a series of subsidy policies targeting consumer electronics and home appliances to stimulate domestic consumption. Beyond the central government's efforts,...
Recent market rumors suggest that Arm is entering the chip development battleground, with Meta's cloud computing chip as its first product. Many are concerned that this indicates...
As Gogoro approaches its 10th anniversary in 2025, interim CEO Henry Chiang has outlined a comprehensive three-year strategy to overcome recent supply chain challenges and leadership...
The global market is watching how TSMC, pressured by the US, might assist Intel's foundry operations, while Samsung Electronics and Rapidus, also facing challenges, may similarly...
Richard Lee, chairman of the Taiwan Electrical and Electronic Manufacturers Association (TEEMA), revealed on February 18, 2025, that a major server manufacturer will announce an expansion...
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
While many major players in the communications supply chain have scaled back investments in satellite technology, MediaTek continues to push forward. The company consistently showcases...
