In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
On July 17, the Biden-Harris Administration announced a non-binding Preliminary Memorandum of Terms (PMT) between the US Department of Commerce and GlobalWafers America, LLC and MEMC...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
By the end of the first quarter of 2024, Dutch semiconductor equipment giant ASML had a backlog of orders totaling EUR 38 billion (US$ 41.4 billion). This means that ASML needs EUR...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
Samsung Electronics has announced that its latest LPDDR5X DRAM has been verified for use in MediaTek's upcoming Dimensity 9400, according to an official statement and a report from...
Chip guru Jim Keller has expressed confidence that more companies will emerge to fill gaps in the AI market, as even Nvidia cannot meet all the demand.
China's aggressive automotive exports caught the world's attention, hitting a record high in the first half of 2024 but starting to slow down after tariffs imposed by Europe and the...
The third quarter of 2024 will see a gradual increase in the demand for industrial memory, and AI IPC applications specifically designed for the industrial control sector are expected...
Samsung Electronics has nearly doubled its NAND Flash production in the second quarter of 2024 after hitting a low point in the fourth quarter of 2023.
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.
Semicon West 2024 was held on July 9-11 in San Francisco, and Tokyo Electron Limited (TEL), the Japanese semiconductor equipment supplier, unveiled the world's first open-source generative...
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
DRAM and NAND flash memory prices will continue to rise in the third quarter, albeit at a slower rate than in the first half of this year, as market circumstances improve more, according...
Taiwan's memory module vendor Moment Semiconductor expects shipments for consumer devices to improve in the second half of 2024, driven by new applications like AI PCs.
