As China accelerates its drive for semiconductor self-reliance, DRAM memory has become a crucial yet understated battleground. SwaySure Technology, a relatively unknown company with...
With industrial-control application demand warming up and DDR4 market prices rising, industrial-control memory vendor Innodisk's operations in 2025 have improved. Revenue has grown...
Samsung Electronics is reportedly planning to introduce a vertical 4F Square structure for its in-development 9nm DRAM products, while continuing development of the existing 6F Square...
SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user...
In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like...
SK Hynix reported second-quarter 2025 revenue of KRW22.23 trillion (US$16.17 billion), up 35% year-over-year, driven by surging demand for AI and high-performance DRAM. The company...
Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
Powerchip Semiconductor Manufacturing Company (PSMC) reported a steeper net loss in the second quarter of 2025, as a stronger New Taiwan dollar and weakening wafer average selling...
The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
Chinese memory giant CXMT is actively advancing its DDR5 and LPDDR5 DRAM process upgrades. According to supply chain sources, although CXMT has yet to enter mass production, recent...
