Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
JCET and Western Digital (WD) agreed on an equity purchase agreement, under which the former will acquire most of the stake in the latter's data storage subsidiary in China, solidifying...
Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...
In 2023, the worldwide semiconductor market faced challenging conditions. Amidst various uncertainties including geopolitics and the broader economy, DIGITIMES Research projects that...
Samsung Electronics is reportedly accelerating automation innovation in its production lines to cope with the memory market downturn and labor shortages. By using manufacturing equipment...
Congressional Democrats demanded in a letter Thursday that the Biden administration add more labor protections to its initiative aimed at boosting US semiconductor production.
Micron Technology unveiled at MWC 2024 that the forthcoming flagship smartphones from Honor and Samsung will feature the company's Universal Flash Storage (UFS) 4.0 mobile flash storage...
With the US, China, and Japan all actively developing semiconductors, the pressure is starting to build for South Korea. In response, the South Korean government is strengthening...
SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...
Micron Technology has begun volume production of its HBM3E memory. Nvidia H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024, will include Micron's...
The memory market has rebounded from the previous trough, led by NAND Flash's multi-fold price surge. However, the NAND business of many integrated device manufacturers (IDMs) is...
