Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...

In 2023, the worldwide semiconductor market faced challenging conditions. Amidst various uncertainties including geopolitics and the broader economy, DIGITIMES Research projects that...

The memory industry is set to exit the production cut phase as Generative AI superpowers high bandwidth memory (HBM) and DDR5 demand.

Samsung Electronics is reportedly accelerating automation innovation in its production lines to cope with the memory market downturn and labor shortages. By using manufacturing equipment...

These are the most-read DIGITIMES Asia stories from February 26 – March 1.

Congressional Democrats demanded in a letter Thursday that the Biden administration add more labor protections to its initiative aimed at boosting US semiconductor production.

Micron Technology unveiled at MWC 2024 that the forthcoming flagship smartphones from Honor and Samsung will feature the company's Universal Flash Storage (UFS) 4.0 mobile flash storage...

With the US, China, and Japan all actively developing semiconductors, the pressure is starting to build for South Korea. In response, the South Korean government is strengthening...

SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...

Samsung is engaged in fierce HBM competition with Micron.

TSMC's new wafer plants in Europe, the US, and Japan are reenergizing automotive IDM firms around the world.

Micron Technology has begun volume production of its HBM3E memory. Nvidia H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024, will include Micron's...

The memory market has rebounded from the previous trough, led by NAND Flash's multi-fold price surge. However, the NAND business of many integrated device manufacturers (IDMs) is...

Taiwan's Minister of Science and Technology, Wu Tsung-tsong, said TSMC's new Kumamoto fab offers win-win outcomes for all involved.

SK Hynix is reported to commence mass production of the fifth-generation High Bandwidth Memory (HBM) HBM3E in March 2024, once again leaping ahead of competitors Samsung Electronics...