News tagged Memory chips at DIGITIMES

NEWS TAGGED MEMORY CHIPS

Wednesday 16 July 2025

Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production

Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...

Wednesday 16 July 2025

Goldkey gears up for August IPO as DDR4 demand takes off

A tight supply of DDR4 DRAM has triggered a buying spree. Goldkey Technology chairman Vicky Tseng said that since May and June 2025, DDR4 spot prices have skyrocketed more than 100%,...

Tuesday 15 July 2025

China's PIM chip sidesteps HBM restrictions, advanced node barriers

China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor...

Tuesday 15 July 2025

DDR4 spot prices surge sharply as memory module makers benefit from high inventory in 2Q25

Driven by major DRAM manufacturers focusing on investment and research in high-bandwidth memory (HBM) and gradually phasing out mature process products, DDR4 spot prices have rapidly...

Monday 14 July 2025

Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

Monday 14 July 2025

Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory...

Monday 14 July 2025

Weekly news roundup: China’s semiconductor setback, MediaTek gains on Qualcomm, and ongoing US-China chip tensions

Below are the most-read DIGITIMES Asia stories from July 7 to July 13, 2025. This week's top three highlights include China’s semiconductor...

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