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Thursday 19 September 2024
Glass substrate technology gains traction for advanced packaging by 2026
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
Wednesday 28 August 2024
Henkel Semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
Wednesday 3 July 2024
China's 8.6G OLED investment boom galvanizes South Korean display equipment industry
China's ongoing OLED investment boom is bringing new opportunities to the South Korean display equipment industry. In particular, many South Korean companies have been selected by...
Friday 28 June 2024
Competitiveness of 6G OLED lines remains despite rising popularity of 8.6G ones
Although many display manufacturers are shifting to 8.6G production lines to improve OLED production efficiency, Korean media reports pointed out that new technology takes time to...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research