TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...

China's ongoing OLED investment boom is bringing new opportunities to the South Korean display equipment industry. In particular, many South Korean companies have been selected by...

Although many display manufacturers are shifting to 8.6G production lines to improve OLED production efficiency, Korean media reports pointed out that new technology takes time to...