Leading FPGA chip maker Xilinx is aggressively moving to tap into the market for chip solutions for 5G base stations, and the move is expected to increase orders by 15% for Taiwan-based...
While chipmakers and brand vendors of smartphones are striving to seek a preemptive presence in the segments of 5G IPs, patents and AP chips, the most critical 5G modem chip solutions...
Taiwan-based backend firms have seen orders from MediaTek fall around 10% sequentially in the fourth quarter of 2018, but expect them to start rebounding in January with substantial...
MediaTek has reported November consolidated revenues fell 10.4% sequentially to a nine-month low of NT$18.67 billion (US$604.2 million). Consolidated sales for the first 11 months...
The global semiconductor industry revenue grew 7.4% sequentially in the third quarter of 2018, reaching a record US$129.8 billion, according to IHS Markit. Semiconductor growth occurred...
Qualcomm has been expanding its local R&D team in Taiwan to bring the company closer to its Taiwan-based partners such as TSMC for the development of 5G mobile chips, according...
Leading mobile chipmaker Qualcomm has revealed that new iPhone models for 2018 may not adopt its modem chip solutions amid a patent royalty row between them. But supply chain sources...
Qualcomm has unveiled what the company claims is the world's first fully-integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and other mobile devices...
It remains to be seen whether Apple will commit to buying modem chips from MediaTek for its next-generation iPhone devices despite mounting speculations that the US vendor is considering...
Speculation has been circulating that Qualcomm will return to TSMC for 7nm. Industry sources believe that the foundry with its 7nm FinFET process node will win back its major contract...
MediaTek has newly released its 5G modem chipset solution, the Helio M70, to be fabricated using TSMC's 7nm process incorporating EUV technology, and will kick off official shipments...
The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.
With the global IoT (Internet of Things) chipset markets, particularly in China, expected to grow sharply in 2018 along with the rapid development of diverse terminal devices and...
