CONNECT WITH US
NEWS TAGGED OMNIVISION TECHNOLOGIES
Thursday 12 December 2019
Backend firms to gain from robust high-spec auto CIS demand
Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Friday 15 November 2019
Tong Hsing sees CIS packaging as major growth driver for 2020
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...
Monday 7 October 2019
Xintec eyeing return to profit in 2019
Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.
Wednesday 2 October 2019
Sony, OmniVision enjoy robust demand from Huawei
CMOS image sensor suppliers Sony and OmniVision have both enjoyed robust demand for multi-camera smartphones from Huawei, with their regional distributors and backend suppliers being...
Friday 23 August 2019
Tong Hsing to see revenues rise through 4Q19
Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially...
Thursday 11 April 2019
China IC design growth may slow to under 20% in 2019, says Digitimes Research
The annual growth of China's IC design industry output value will likely slow to less than 20% in 2019, for the first time since 2011, according to Digitimes Research.
Tuesday 19 February 2019
CIS backend firm Kingpak to post 10-15% revenue growth in 2019
CMOS image sensor (CIS) backend service provider Kingpak Technology is expected to enjoy revenue growth of 10-15% in 2019 with higher profits than year-ago levels, according to market...
Friday 12 January 2018
Spreadtrum and OmniVision introduce turnkey active stereo 3D camera reference design for smartphones
OmniVision Technologies and Spreadtrum Communications have jointly announced what they call the industry's first turnkey active stereo 3D camera reference design for smartphones....
Friday 8 December 2017
Taiwan IC packagers eyeing auto chip orders from IDMs
As the automotive-use chip sector is emerging as a new niche market with great development potential, Taiwan IC packaging and testing service providers are gearing up to scramble...
Tuesday 24 October 2017
Sony to expand CIS presence in car electronics market
Sony has been strengthening its high-end CMOS image sensor (CIS) development and is looking to expand its presence in the car-use electronics market. The efforts are expected to bear...
Thursday 21 September 2017
KYEC grabs testing orders for analog, PA chips from Murata
King Yuan Electronics (KYEC) has recently obtained testing orders for analog chips and power amplifiers (PA) from Murata Manufacturing, according to industry sources.
Friday 25 August 2017
Xintec loss widens in 1H17
Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.
Friday 30 June 2017
Tong Hsing starts shipments for 3D sensing products
Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...
Wednesday 28 June 2017
CMOS image sensor sales to reach another record high in 2017, says IC Insights
CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...
Thursday 1 June 2017
Sony gives priority to Apple, China-based vendors for CIS capacity
Sony has given priority to Apple, and China-based Huawei, Oppo and Vivo for CMOS image sensor (CIS) capacity, according to industry sources.