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NEWS TAGGED PACKAGING
Tuesday 19 November 2024
GPTC sees wet process equipment orders soar on advanced packaging boom in 2025
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
Monday 18 November 2024
MKS' Atotech and ESI at TPCA show and IMPACT 2024
The TPCA Show and IMPACT Conference 2024 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 23rd to 25th. Two strategic brand presences of MKS, Atotech,...
Friday 15 November 2024
Samsung's Pyeongtaek P4 expands to NAND + DRAM; to host premier packaging facility in Cheonan
Samsung Electronics is reportedly finalizing investment plans for the first production line at its Pyeongtaek Plant 4 (P4) facility in South Korea, rebranding it to focus on mass-producing...
Thursday 14 November 2024
Chairman of top Chinese OSAT 'JCET' resigns after state-owned company becomes largest shareholder
JCET Group, China's top semiconductor packaging and testing firm, announced on November 13, 2024, that chairman Yonggang Gao, along with directors Peng Jin and Chunsheng Zhang, have...
Thursday 14 November 2024
Chip resistor supplier Ta-I maintains 70-80% utilization rate amid stable pricing
Taiwan-based chip resistor maker Ta-I Technology currently maintains a capacity utilization rate of 70-80%, with prices remaining stable thanks to a more balanced supply and demand...
Wednesday 13 November 2024
With CoWoS demand booming, fab equipment maker GPTC seeks to keep up with TSMC
Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC's CoWoS packaging, aims to leverage the rising demand.
Wednesday 13 November 2024
Machvision invests in Hye Technology, eyes growth in advanced packaging
Machvision's board has approved a NT$274 million (US$8.6 million) strategic investment to acquire 13% of Hye Technology's common shares. The investment will represent 11.5% of Hye's...
Tuesday 12 November 2024
Taiwan fab toolmakers benefit from TSMC's CoWoS demand spike
A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing together executives from TSMC and its ecosystem partners including...
Monday 11 November 2024
ASE expands to Mexico with first North American packaging facility post-US election
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...