中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Singapore launches new supercomputer to expand AI and research capabilities
    9min ago
    Montage Tech samples 9200 MT/s DDR5 RCD06 chip for AI server memory upgrade
    16min ago
    Taiwan Mask sells Zhunan plant to Siliconware Precision Industries for NT$2.8 billion
    23min ago
    CPO production delay may boost growth of LPO and NPO
    Jun 10, 19:51
    Taiwanese chips gain from non-China drone supply chain demand
    Jun 10, 19:51
    Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full
    Jun 10, 19:51
    NEWS TAGGED PACKAGING
    Thursday 16 October 2025
    ASML lifts margin outlook, signals cautious 2026 growth with XT:260 launch
    ASML Holding NV offered a cautiously optimistic outlook during its third-quarter 2025 earnings call on October 15, 2025, pointing to higher fourth-quarter sales and margin improvements,...
    Thursday 16 October 2025
    OCP Summit: Arm expands ecosystem to support AI workloads and chiplet integration
    Arm is strengthening its ecosystem for next-generation AI applications by adding partners across firmware, ASIC design, networking, and packaging. The company is also advancing chiplet...
    Thursday 16 October 2025
    TSMC's advanced chip orders surge with AI boom, boosting Taiwan's OSAT sector

    As TSMC prepares to release its latest financial results, investor optimism remains high despite renewed concerns over an AI bubble. Industry...

    Wednesday 15 October 2025
    Semiconductor material distributors post strong revenue growth from AI and HPC demand
    Several semiconductor materials distributors have posted robust revenue growth, reflecting rising demand driven by advancements in artificial intelligence (AI) and high-performance...
    Wednesday 15 October 2025
    Exclusive: Arizona Commerce Authority President says state is ready for semiconductor growth
    The semiconductor industry in Arizona is experiencing rapid expansion, with the Arizona Commerce Authority (ACA) playing a pivotal role.
    Tuesday 14 October 2025
    Intel's Panther Lake chips enter production, anchoring AI ambitions in the US

    Intel has officially launched production at its state-of-the-art Fab 52 facility in Arizona, the company announced on October 9. The milestone...

    Monday 13 October 2025
    Niching sustains growth momentum in heat spreaders and IC substrates amid AI server and auto electronics demand
    Taiwan-based Niching Industrial continues its steady growth trajectory in 2025, buoyed by robust demand from AI servers and automotive electronics. The company's heat spreader and...
    Monday 13 October 2025
    Amkor increases Arizona investment to US$7 billion, highlights TSMC's impact
    Amkor Technology is dramatically expanding its footprint in the US, committing US$7 billion to build its first advanced semiconductor packaging plant in Phoenix. The move, which makes...
    Saturday 11 October 2025
    Nemstek targets semiconductor market growth with listing planned for November
    Nemstek, a leading plasma equipment manufacturer, has intensified its focus on semiconductor, ABF substrate, PCB, and new energy environmental applications in recent years, steadily...
    Thursday 9 October 2025
    Applied Materials advances AI chip performance with hybrid bonding and e-beam metrology
    To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing...
    Thursday 9 October 2025
    Commentary: China's TGV ambitions face an uphill battle
    China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
    Thursday 9 October 2025
    Glass substrate TGV: China's edge to capture AI HPC packaging
    China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
    Thursday 9 October 2025
    Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
    SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
    Thursday 9 October 2025
    IMPACT 2025: Asia's Largest Packaging & PCB Event in the AI Era
    The IMPACT Conference, Asia's largest international event on advanced packaging and circuit boards, will celebrate its 20th anniversary this year at Nangang with its biggest program...
    Wednesday 8 October 2025
    China and Taiwan chart diverging paths in the 12-Inch SiC market
    In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...
    40/56 pages
    AsiaCPO
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook