The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers...

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...

Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...

Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.