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Thursday 2 December 2021
Will Samsung 3nm GAA process win over major TSMC clients?
Samsung Electronics has been actively pursuing 3nm GAA chip orders, with speculation that AMD and Qualcomm could be among the first customers of its newer foundry process technology...
Thursday 25 November 2021
Highlights of the day: TSMC expands partnership with OSATs
To meet surging demand for heterogeneous chips, TSMC is expected to adopt a more agile mode of cooperation with OSATs...
Thursday 25 November 2021
GaN Systems, USI partner to accelerate GaN adoption in EVs
GaN Systems has announced a strategic partnership with Universal Scientific Industrial (USI), a subsidiary of ASE Technology, to co-develop GaN power modules for the electric vehicle...
Tuesday 23 November 2021
TSMC ecosystem partners see bright prospects ahead
TSMC's ecosystem partners, particularly equipment makers, are poised to embrace strong growth momentum, as the foundry will be expanding its fab capacities over the next three years,...
Wednesday 10 November 2021
TSMC, Sony to form JV foundry in Japan
TSMC and Sony Semiconductor Solutions (SSS) have jointly announced plans to establish a joint-venture foundry in Kumamoto, Japan to initially provide 22nm and 28nm process manufacturing...
Friday 5 November 2021
Gogoro in strategic partnership with Gojek to boost urban smart mobility in Indonesia
Own-brand electric scooter maker Gogoro has signed with Gojek, an Indonesia-based provider of mobile on-demand services including ride-hailing, for a strategic partnership to promote...
Thursday 4 November 2021
MIH open ecosystem accelerates EV sector takeoff
From 5G wireless communications to electrical vehicles (EV), open architectures, such as open radio access network (O-RAN) and MIH open EV development platform, are serving as an...
Wednesday 22 September 2021
mmWave finds potential markets in 5G and Satcom: Q&A with MixComm and SiTune CTOs
MixComm, a provider of millimeter-wave (mmWave) and front-end solutions for 5G and Satcom applications, has recently announced a collaboration with SiTune, an innovator of multiple...
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Thursday 9 September 2021
Arm, Taiwan's ITRI join force to help IC design startups grow
Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Wednesday 25 August 2021
Allxon, Trend Micro partnership aims to strengthen security of edge devices
Allxon, a remote monitoring and management platform, has announced a partnership with information security company Trend Micro. Through this partnership, Allxon will integrate Trend...
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...