Large-size panel manufacturers, including AUO and Innolux, saw revenue growth in August. AUO, in particular, experienced a significant year-over-year revenue increase due to its merger...
As Apple prepares for its September 9 event, the industry is closely examining major suppliers' August results for insights into potential iPhone performance.
The president of Acer's Pan-Asia Pacific operations, Andrew Hou, pointed out that irresistible momentum in India and Indonesia, coupled with a rebound in business PC sales, has offset...
Hon Hai Technology Group (Foxconn) has disclosed that its revenue decreased sequentially by 4.2% in August. However, the company remains optimistic that its revenue will increase...
Qualcomm recently announced the expansion of the Snapdragon X series at the International Radio Exhibition Berlin (IFA Berlin 2024). Company CEO Cristiano Amon expressed confidence...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Artificial Intelligence (AI) is boosting rapid advancements in data center construction but with increasingly massive power demands. Research institutions predict that energy consumption...
At an event in Berlin on September 4, Intel introduced the Core Ultra 200V series processors, codenamed Lunar Lake. These new processors represent Intel's most efficient x86 architecture...
Despite Samsung Electronics' high expectations for the sales performance of its newly launched foldable smartphones, the Galaxy Z Fold 6 and Flip 6, intense competition from rivals...
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
According to online monitoring data from Runto Technology (Runto), sales of color e-paper products in China's market grew by 318.2% year-on-year in the first half of 2024, with the...
