TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...

Rugged embedded computer brand – Cincoze has launched two new series of GPU-embedded computers that overcome harsh environmental challenges, meet various application requirements,...

Rohm Semiconductor and Valeo have jointly announced a collaboration to design and develop the next generation of power modules for electric motor inverters, combining their expertise...

Hannstar Display, a mid-sized panel manufacturer, is shifting its automotive development focus to India in response to geopolitical factors. Currently, automotive products represent...