Struggling with prolonged financial headwinds, Nissan Motor Co. has announced plans to shutter one of its core production sites, the Oppama plant, by March 2028. Talks to sell the...
The annual SEMICON West relocated for the first time to Phoenix in 2025, the new hub of US chip manufacturing. Compared to previous years, the event saw a 45% increase in exhibitors,...
China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
Phoenix Silicon International (PSI) has officially launched the expansion of its Zhonggang FAB3A/B manufacturing complex, announcing plans for the new FAB3B plant to begin production...
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
Global Lighting Technologies (GLT) has liquidated its Zhongshan factory in Guangdong, China and has plans to start trial production at its new facility in Vietnam facility in the...
OpenAI has recently intensified collaborations with chip suppliers, signing an AI GPU partnership with AMD following deals with Nvidia and Broadcom. This move revitalizes the previously...
Qualcomm has announced the acquisition of Italian open-source hardware and software company Arduino, assuring that Arduino's brand mission and community spirit will remain intact...
Taiwanese printed circuit board (PCB) manufacturer Allied Circuit (ACCL), a subsidiary of Compal Electronics, has entered a joint venture with Japanese firm Meiko to establish an...
Pahal Solar, an Indian startup integrating artificial intelligence (AI) into solar manufacturing, plans to invest INR170 million (approx. US$1.91 million) to double its production...
Samsung Electronics, the leader in NAND flash, has reportedly entered the high-bandwidth flash (HBF) memory market, signaling a potential shift in the competitive landscape of next-generation...
Taiwan's Ministry of Economic Affairs (MOEA) has approved a NT$160 million (US$5.27 million) allocation from a contingency fund to support the Industrial Technology Research Institute...
China is enhancing its DUV lithography technology amid US export restrictions. Yuliangsheng's 28nm immersion DUV machine is being tested at SMIC, while SMEE has patented a method...
Chinese NAND Flash giant Yangtze Memory Technologies Corp. (YMTC) is preparing to enter the high-bandwidth memory (HBM) market and is anticipating a technological breakthrough. As...
