Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...
As Nvidia Blackwell GB200 chips near the mass production and shipment stage, supply chain players are already making initial preparations for the next-generation Rubin AI platform...
The price collapse of 6-inch silicon carbide (SiC) substrates is taking its toll on the 8-inch segment, where volume production has yet to begin but prices are already tumbling, according...
Samsung Electronics has dissolved its LED business under the Device Solutions (DS) division. However, the company will redirect related personnel towards the R&D of high-value-added...
TsangYow, a major transmission system manufacturer, is experiencing positive growth due to the recovery of the aftermarket (AM) component market. The company's monthly revenue continues...
Samsung Electronics is set to launch its flagship smartphone Galaxy S25 series in early 2025, with plans to produce approximately 22 million units by June 2025.
Samsung Electronics is currently grappling with the choice of application processors (AP) for its Galaxy S25 series, but time is running out to make the final decision.
Luxshare Precision Industry, Apple's primary Chinese partner, has accelerated its capacity expansion in Vietnam by expanding its factory site in Nghe An, according to industry sour...
Wolfspeed, a US-based silicon carbide (SiC) chipmaker, has secured up to US$750 million in federal funding to construct a new wafer plant in North Carolina and expand its New York...
CMI, the leading flexible printed circuit (FPC) board manufacturer, held its earnings call on October 15. Ming-Feng Cheng, CMI's spokesperson, announced that future product development...
As the second wave of iPhone 16 shipments begins, supply chain sources report that sales have underperformed. Apple's 2024 strategy centered on Apple Intelligence, but key features...
Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.
The Ministry of Economic Affairs released the latest statistics on server production on October 15, highlighting Taiwan's strong position in the global server manufacturing industry...
TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...
