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Thursday 26 September 2024
Micron eyes production boost amid Samsung's HBM entry and Chinese rivalry
Despite a positive outlook for the memory market, driven largely by data centers, Micron anticipates Samsung Electronics' entry into the HBM market and is shifting toward higher-value...
Wednesday 25 September 2024
Apple's affordable MR device sees more downgrades; may be equipped with 1,500 PPI OLED
The possibility of Apple developing a more affordable Mixed Reality (MR) device is growing. It is rumored to feature an OLED display with a pixel density of 1,500 PPI to reduce manufacturing...
Wednesday 25 September 2024
TSMC adopts SMC's chillers for 2nm trial production
Japan-based SMC has announced that it has shipped chillers to TSMC for the trial production of 2nm chips. SMC is launching chiller products specifically for advanced semiconductor...
Wednesday 25 September 2024
China's startups fast-track solar revolution with perovskite technology
Japan may have pioneered perovskite solar cell (PSC) technology, but mass production remains elusive. In China, however, at least six startups are racing ahead, building PSC factories...
Wednesday 25 September 2024
Samsung foundry struggles intensify: Yield issues prompt exodus of key components
Samsung Electronics' foundry division is reportedly struggling to attract major customers due to low yield rates and persistent quality issues. These challenges are affecting the...
Wednesday 25 September 2024
India-based Sahasra unveils IPO date, eyeing memory ATMP business
Sahasra Electronics, an India-based electronics manufacturing services (EMS) provider eyeing the semiconductor packaging business, is set to launch an initial public offering (IPO)...
Wednesday 25 September 2024
JCET expands HBM packaging and testing as China accelerates domestic production
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Wednesday 25 September 2024
Kioxia secures US$841 million loan to boost latest NAND production for AI and data centers
Kioxia, a leading player in the NAND flash industry, has secured a loan commitment of JPY120 billion (US$841 million) from major financial institutions. This financing will enable...
Wednesday 25 September 2024
Henkel expands semiconductor focus in India with plans for advanced packaging
As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor...
Wednesday 25 September 2024
Innolux expands FOPLP focus beyond automotive, PMIC
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
Wednesday 25 September 2024
AMD's next-gen AI GPU to intensify competition in 4Q24
AMD will launch a new generation of MI325X chips utilizing HBM3E in October to enhance its standing in the AI GPU market, aiming to secure orders from AI server clients seeking to...
Wednesday 25 September 2024
Chinese chipmakers gearing up for Huawei's next flagship launch despite hefty cost
Huawei is preparing to launch its latest flagship Mate 70 series, a product bolstered by substantial government support and suppliers, particularly SMIC, who are reportedly sacrificing...
Tuesday 24 September 2024
China's mature chip dominance looms, Taiwan IC designers urged to prioritize sub-7nm
China is poised to take the lead in the global market for mature semiconductor manufacturing processes as it continues to expand its production capacity. Industry experts warn that...
Tuesday 24 September 2024
Garmin's SEA sales continue to soar as smart wearables enter maturity
Smart wearable products have gained significant traction in recent years, with major tech brands actively releasing new devices. Apple, Samsung Electronics, and Google have all launched...
Tuesday 24 September 2024
TSMC SoIC fab capacity to reportedly boost through to 2026
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research