Foxconn is reportedly evaluating an investment of US$1 billion to establish a smartphone display module assembly plant in Tamil Nadu, India, possibly the first in Southern India,...
Technological breakthroughs in diamond semiconductors, known for their superior performance despite technical challenges, could lead to practical applications as early as 2025 to...
In light of the escalating trade conflict between the US and China, coupled with the 2020 pandemic-induced global chip shortage, numerous nations are prioritizing local semiconductor...
Semco has developed the world's first "mini oxide-based solid-state battery" capable of being integrated into wearable devices. The company is reportedly conducting product tests...
E Ink's color-changing e-paper has garnered significant attention since it collaborated with BMW, attracting interest for various products, although these collaborative products remain...
Before 2020, almost all smartphones incorporated LTPS technology for their AMOLED panels. However, many manufacturers are turning to LTPO, especially now that generative AI (GenAI)...
Europe's homegrown lithium battery sector is grappling with widening losses as electric vehicle (EV) demand slows and automakers face challenges in their transition to electrificat...
STMicroelectronics, while expanding production capacities in France and Italy, is also collaborating with Sanan Optoelectronics to establish a SiC fab in Chongqing, underscoring China's...
Thailand is set to make a significant stride in the semiconductor industry with the establishment of its first silicon carbide (SiC) wafer factory, which is expected to begin operation...
The global printed circuit board (PCB) industry is experiencing significant shifts due to geopolitical factors, with many manufacturers moving production from China to Southeast Asia...
Trio Technology International Group, a Taiwan-based passive component maker, expects demand for AI and automotive device applications to drive growth in the coming years.
ODMs without US manufacturing capabilities have initiated active procurement discussions following AMD's acquisition of ZT Systems, with the upcoming US presidential election potentially...
Leading OEM and automobile firms, including Foxconn, BYD, and Xiaomi, are showcasing their collaborative robots (cobots) at the 2024 China International Industry Fair (CIIF), held...
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
Despite a positive outlook for the memory market, driven largely by data centers, Micron anticipates Samsung Electronics' entry into the HBM market and is shifting toward higher-value...
