Japan may have pioneered perovskite solar cell (PSC) technology, but mass production remains elusive. In China, however, at least six startups are racing ahead, building PSC factories...
Samsung Electronics' foundry division is reportedly struggling to attract major customers due to low yield rates and persistent quality issues. These challenges are affecting the...
Sahasra Electronics, an India-based electronics manufacturing services (EMS) provider eyeing the semiconductor packaging business, is set to launch an initial public offering (IPO)...
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Kioxia, a leading player in the NAND flash industry, has secured a loan commitment of JPY120 billion (US$841 million) from major financial institutions. This financing will enable...
As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor...
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
AMD will launch a new generation of MI325X chips utilizing HBM3E in October to enhance its standing in the AI GPU market, aiming to secure orders from AI server clients seeking to...
Huawei is preparing to launch its latest flagship Mate 70 series, a product bolstered by substantial government support and suppliers, particularly SMIC, who are reportedly sacrificing...
China is poised to take the lead in the global market for mature semiconductor manufacturing processes as it continues to expand its production capacity. Industry experts warn that...
Smart wearable products have gained significant traction in recent years, with major tech brands actively releasing new devices. Apple, Samsung Electronics, and Google have all launched...
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Japan has officially launched the Japan Hydrogen Fund, a US$400 million initiative aimed at advancing the global hydrogen supply chain and reducing barriers to clean energy adoption...
China's automobile manufacturers are reportedly asking silicon carbide (SiC) module vendors to cut prices by as much as 30% amid growing supply, according to industry sources.
Solar energy industry personnel pointed out that after N-type tunneling oxide passivated contact (TOPCon) became the trend in 2024, there was a severe supply surplus. Many businesses...
