E Ink Holdings (EIH) will build new production lines in Taiwan for making e-paper film and in China for making e-paper materials, according to company chairman and CEO Johnson Lee.
Chemical materials maker Eternal Materials has disclosed it is expanding production capacity for dry film photoresist at its factory in Suzhou, China, with the additional capacity...
Polarizer maker BenQ Materials is expanding production capacity for separator films used in EV Li-ion batteries at its factory in central China, with completion scheduled for the...
The arrival of new flexible PCB production capacity and rising HDI PCB demand for low earth orbit (LEO) satellites will buoy Compeq Manufacturing's sales performance in the second...
BASF Toda Battery Materials (BTBM), a Japan-based maker of cathode materials established by Germany-based BASF and Japan-based Toda Kogyo on a joint-venture basis, will expand production...
Japan's Sumitomo Metal Mining (SMM) has decided to construct a new 8-inch direct bonded SiC wafer substrate mass-production prototype line, which will be completed for March 2024...
Electric terminal maker KS Terminals (KST) will expand production capacity for electric vehicle (EV)-use power charging connectors and inlets through setting up a factory in Taiwan...
The supply of SSD and other NAND flash device controller chips, which are manufactured using 55nm, 40nm and 28nm process technologies at 12-inch fabs, has become less tight as foundries...
Tight capacity supply at 8-inch wafer fabs is on track to ease on weakening demand for large-size display driver ICs, CMOS image sensors (CIS) and even power management ICs (PMIC)...
LED epitaxial wafer and chip maker Epistar is in preparation for setting up microLED chip production capacity, according to its parent company Ennostar.
DRAM maker Nanya Technology has broken ground on its new 12-inch wafer plant designed for production capacity of 45,000 wafers monthly. The plant construction will be in three phases,...
Labor shortage has become a new normal at manufacturing industries worldwide in the post-pandemic era, and this is driving device assemblers including notebook ODMs and network device...
IC design houses are negotiating with upstream foundries about their wafer starts between the end of 2022 and early 2023, but are finding it difficult to plan, according to industry...
