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Tuesday 12 November 2024
Samsung eyes TSMC alliance to close HBM gap with SK Hynix
Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to follow, packing twelve. In a strategic bid to reclaim HBM...
Monday 11 November 2024
Kioxia invests in CXL memory, aims for commercialization in 2030
Kioxia has announced plans to develop next-generation memory technology, Compute Express Link (CXL), to address the growing demands of AI, with support from the Japanese government...
Monday 11 November 2024
US directive halts TSMC's sub-7nm supply to China; Samsung, SMIC may fill gap amid AI funding and capacity strain
On November 11, 2024, TSMC reportedly suspended its sub-7nm process services to China's AI and GPU chipmakers following the Huawei "chip controversy," triggering widespread industry...
Monday 11 November 2024
Weekly news roundup: TSMC's Arizona milestone looms as global chip industry navigates political, technical crossroads
Semiconductor Week in Review (Nov 3 - 9): The semiconductor industry faces a transformative moment as TSMC readies its Arizona fab's politically-charged December opening and Intel's...
Friday 8 November 2024
Trump's win sets off race to complete Chips Act subsidy deals
The Biden administration is racing to complete Chips Act agreements with companies like Intel Corp. and Samsung Electronics Co., aiming to shore up one of its signature initiatives...
Friday 8 November 2024
Bolstered by US partnerships, Micron's HBM3E progress outpaces Samsung
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
Thursday 7 November 2024
Apple reportedly offers Indonesia manufacturing investment to overturn iPhone ban
Apple has submitted a US$10 million investment plan to the Indonesian government in hopes of lifting the ban on the iPhone 16 to enable its immediate sale in the local market.
Wednesday 6 November 2024
HBM and beyond: SK Hynix deepens strategic partnership with TSMC
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
Wednesday 6 November 2024
Samsung's new semiconductor R&D campus to launch, driving next-gen memory development
Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November...
Tuesday 5 November 2024
SDC advances its 8.6G IT OLED mass production plan to 2025
Samsung Display (SDC) plans to accelerate the production of its 8.6G OLED panels for IT applications, which will first be utilized in Samsung Electronics' notebook products.
Tuesday 5 November 2024
2024 memory market trends: A timeline characterized by AI demand and rising prices
The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery,...
Tuesday 5 November 2024
Lessons from Vietnam: how Apple could strengthen its supply chain amidst struggling expansion in India
Amid the ongoing US-China conflict, the industry is focusing on Apple's efforts to shift its supply chain away from China to other regions. However, one of Apple's primary alternative...
Monday 4 November 2024
Samsung denies voluntary retirement and layoff rumors as executives strategize foundry solutions
Reports indicate that Samsung is exploring a voluntary retirement plan for its DS division. Rumors also suggest the program could expand across the company, impacting the Mobile eXperience...
Monday 4 November 2024
Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Monday 4 November 2024
Samsung plans 400+ layer NAND and cutting-edge DRAM for 2026 to reclaim AI memory market
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research