The global wafer foundry landscape is undergoing a dramatic transformation. TSMC maintains its dominance in advanced nodes below 7 nanometers, while competitors Samsung and Intel...
Micron Technology announced during its latest investor conference that its HBM4 development is progressing as planned while revealing development of HBM4E is underway. The company...
Samsung Electronics Co. and Texas Instruments Inc. completed final agreements to get billions of dollars of government support for new semiconductor plants in the US, cementing...
Samsung Display is advancing its microOLED technology by shifting from silicon wafers to glass substrates, a move aimed at improving production efficiency and reducing costs for AR/VR...
The world's third-largest NAND flash manufacturer, Kioxia, has officially gone public in Japan, securing funding for investments in artificial intelligence (AI) semiconductor technologies...
The competition for advanced logic processes at the 2-nanometer level will enter its production phase in 2025. Following their absence in the 5nm and 3nm generations, both Intel and...
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
Samsung Electronics is doubling down on mature process foundry services while strengthening partnerships with IC design firms to expand its footprint in China, carefully navigating...
LG Display (LGD) has spent over a decade investing in OLED TV panel technology. However, the market's growth remains sluggish as Samsung Electronics and Chinese manufacturers prioritize...
TSMC and Samsung Electronics (Samsung) are set to begin mass production of 2nm technology starting in 2025. Both industry giants are actively vying for customer orders. The South...
Samsung Electronics is stepping up talent recruitment in China to advance next-generation semiconductor development. With China's rapidly growing semiconductor IP market, Samsung...
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on...
Following Huawei's recent advancements, TCL, a leading Chinese home appliance brand, has revealed its dual-folding technology, signaling potential plans for a tri-fold smartphone...
